研究领域

微纳电子机械系统级微纳传感器、三维集成芯片系统、RF MEMS及BioMEMS的研究"科学研究

主持的科研项目包括十二五预研2项，兵器预研2项，参与国家自然科学基金3项"

近期论文

学术论文
近两年发表的SCI文章：
• Yingtao Ding, Yangyang Yan, and Qianwen Chen, Electrical Characteristics of a Novel Interposer Technique Using Ultra-Low-Resistivity Silicon-Pillars with Polymer Insulation as TSVs, Microelectronics Engineering
• Yingtao Ding, Yangyang Yan, and Qianwen Chen, Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner, Microelectronics Reliability,54(6-7):1384-1391,2014.
• ZHONG ShunAn, WANG ShiWei, DING YingTao*, Thermal reliability analysis and optimization of polymer insulating through-silicon-vias (TSVs) for 3D integration, Sci China Tech Sci, 57(1): 128-135, 2014.
• Yingtao Ding, Yangyang Yan, and Qianwen Chen, Investigation on mechanism of polymer filling in high-aspect-ratio trench for through-silicon-via(TSV) application, Sci China Tech Sci, 57(1): 2014.
• DANG Hua, DING Yingtao, WANG Zheyao, Cell trapping and patterning using dielectric-structure-assisted negative dieletrophoresis, Sci China Tech Sci, 56(4): 1001-1007,2013.