近期论文

Likun Zang , Zhangfu Yuan, Yuanqing Zhu, Bingsheng Xu , Hiroyuki Matsuura , Fumitaka Tsukihashi，Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523K to 673K，Colloids and Surfaces A: Physicochemical and Engineering Aspects. 414 (2012) 57– 65（IF 2.236）ISSN:0927-775;
Likun Zang, Zhangfu Yuan, Zhanmin Cao, Hiroyuki Matsuura, Fumitaka Tsukihashi， Reactive Wetting Processes and Triple-line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures，Journal of Electronic Materials, 2012, 41, 8: 2051-2056.（IF 1.709）;
ZANG LiKun, YUAN ZhangFu, ZHAN YaPeng, WANG ChenYu，XU BingSheng, Spreading Kinetics of a Sn-30Bi-0.5Cu Alloy on a Cu Substrate, Chinese Science Bulletin. 57(6), (2012) 682-686.（IF 1.321）;
Likun Zang, Zhangfu Yuan, Hongxin Zhao，Xiaorui Zhang：Wettability of molten Sn-Bi–Cu solder on Cu substrate，Materials Letters，2009，63：2067–2069.（IF 2.307）;
Likun Zang， Zhangfu Yuan, Hongyan Xu, Bingsheng Xu， Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503K to 673 K Applied Surface Science 257 (2011) 4877–4884（IF 2.103）;