个人简历

学习与工作简历： 1985.9-1990.6 清华大学材料系材料科学专业本科 1992.9-1994.6 清华大学材料系材料物理专业 硕士 1994.9-1997.6 天津大学理学院应用物理学系 博士 1997.6-2003.6 天津大学理学院应用物理学系 副教授 2003.6至今　 天津大学理学院应用物理学系　 教授 1999.9-2000.9 美国波士顿东北大学工学院博士后访问学者 2005.1-2005.6 澳大利亚悉尼大学　访问学者

研究领域

1：无铅焊球的制备及其凸点互连结构的可靠性研究 冷却凝固理论模型、材料设计与第一性原理计算 新型粉体材料、纳米磁性薄膜的制备及其性能研究

近期论文

1.L. J. Liu, W. Zhou, W. K. Mu and P. Wu*, Interfacial reactions of Sn-3.5Ag-xZn solders and Cu substrates during liquid state aging, Journal of Electronic Materials, 40 (2011) 306-314. 2.W. Zhou, P. F. Xing and P. Wu*, Ferromagnetism in nitrogen-doped cubic ZrO2: Density-functional investigations, Scripta Materialia, 63 (2010) 776-779. 3.W. Zhou, L. J. Liu, B. L. Li and P. Wu*, Fast Mass migration in Sn-Bi deposits enhanced by electric current, Thin Solid Film, 518 (2010) 5875-5880. 4.L. J. Liu, W. Zhou, B. L. Li and P. Wu*, Interfacial Reactions between Sn-8Zn-3Bi-xNi lead-free and Cu substrate during isothermal aging, Materials Chemistry and Physics, 123 (2010) 629-633. 5.W. Zhou, L. J. Liu and P. Wu*, Structural, electronic and thermo-elastic properties of Cu6Sn5 and Cu5Zn8 intermetallic compounds: first-principles investigation, Intermetallics, 18 (2010) 922-928. 6.S. Li, J. Zhang, P. Wu*, Numerical solution and comparison to experiment of solute drag models for binary alloy solidification with a planar phase interface, Scripta Materialia, 62 (2010) 716-719. 7.S. Li, J. Zhang, P. Wu*, A comparative study on migration of a planar interface during solidification of non-dilute alloys, Journal of Crystal Growth, 312 (2010) 982-988. 8.L. J. Liu, W. Zhou, B. L. Li and P. Wu*, Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint, Microelectronics Reliability, 50 (2010) 251-257 9.W. Zhou, L. J. Liu, B. L. Li, P. Wu* and Q G. Song, Structural, elastic and electronic properties of intermetallics in the Pt-Sn system: a density functional investigation, Computational Materials Science, 46 (2009) 921-931. 10.W. Zhou, L. J. Liu, P. Wu*, First-principles study of structural, thermodynamic, elastic and magnetic properties of Cr2GeC under pressure and temperature, Journal of Applied Physics, 106 (3) (2009) 033501. 11.W. Zhou, L. J. Liu, P. Wu*, Nonmagnetic impurities induced magnetism in SnO2, Journal of Magnetism and Magnetic Materials, 321(2009) 3356-3359. 12.S. Li, J. Zhang, P. Wu*, Numerical test of generalized marginal stability theory for a planar interface during directional solidification, Scripta Materialia, 61 (2009) 485-488. 13.W. Zhou, L. J. Liu, B. L. Li, P. Wu*, Effect of intermetallics on electromigration and atomic diffusion in Cu/SnAg3.0Cu0.5/Cu joints: experimental and first principles study, Journal of Electronic Materials, 38(6) (2009) 866-872. 14.L. J. Liu, W. Zhou, B. L. Li and P. Wu*, Interfacial Reactions between Sn-8Zn-3Bi-xAg lead-free solders and Cu Substrate, Journal of Alloys and Compounds, 482 (2009) 90-98. 15.W. Zhou, L. J. Liu, B. L. Li, Q G. Song and P. Wu*, Structural, elastic and electronic properties of Al-Cu intermetallics from first-principles calculations, Journal of Electronic Materials, 38(2) (2009)356-364. 16.S. Li, P. Wu, H. Fukuda, T. Ando, Simulation of the Solidification of Gas-Atomized Sn-5mass%Pb Droplets, Materials Science and Engineering A, 499 (2009)396-403. 17.Q. Zhao, P. Wu, B. L. Li, Z. M. Lu and E. Y. Jiang, Activation of room-temperature ferromagnetism in nonstoichiometri TiO2?δ powders by oxygen vacancies, Journal of Applied Physics, 104 (7) (2008) 073911. 18.S. Li, P. Wu, W. Zhou, T. Ando, Kinetics of heterogeneous nucleation of gas-atomized Sn-5mass%Pb droplets, Materials Science and Engineering A, 473 (2008) 206-212. 19.D. Y. Peng, B. L. Li, X. L. Chen, E. Y. Jiang, H. L. Bai, Z. Q. Li and P. Wu*, Microstructure and thermal stability of Al-Ti alloys prepared by mechanical milling and reactive sintering, Powder Metallurgy, 50(1) (2007) 28-32. 20.Y. J. Li, P. Wu*, T. Ando, Continuous cooling transformation diagrams for the heterogeneous nucleation of Sn-5mass%Pb droplets catalyzed by surface oxidation, Materials Science and Engineering A, 419 (2006) 32-38.