个人简历
工作经历 2009-2012 哈尔滨工业大学, 化工学院, 博士后 2009-至今 哈尔滨工业大学, 基础与交叉科学研究院, 讲师、副教授 教育经历 1998年-2002年, 哈尔滨工业大学, 材料成型与控制工程, 学士学位 2002年-2004年, 哈尔滨工业大学, 材料加工工程, 硕士学位 2004年-2008年, 哈尔滨工业大学, 材料加工工程, 博士学位
研究领域
电子封装键合点和焊点的形成机制、性能表征及其可靠性 柔性电子封装及柔性互连 含能材料外场诱导限域反应及其应用 仿生超材料功能设计及其封装组装
近期论文
Ying Zhong, Rong An, Chunqing Wang, Zhen Zheng, Zhi-Quan Liu, Chin-Hung Liu, Cai-Fu Li, Tae Kyoung Kim, Sungho Jin. Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections. Small (IF=8.368), 11(33), 4097-4103, 2015. Hailong Li, Rong An, Chunqing Wang, Bin Li. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing. Materials Lettes (IF=2.489). 158, 252-254, 2015. Jiandong Zhu, Rong An, Chunqing Wang, Wei Liu. Synthesis of CrO single crystal slices by firing under water vapor atmosphere. Materials Lettes (IF=2.489). 2015, 152:13-16. Jiandong Zhu, Rong An, Chunqing Wang, Wei Zhang, Guangwu Wen. Characterization of the Microstructure of an AlN-Mullite-Al2O3 Ceramic Layer on WCu Composite Alloy for Microelectronic Application. Journal of Electronic Materials (IF=1.798), 44(11), 4154-4160, 2015 Rong An, Yanhong Tian, Rui Zhang, Chunqing Wang. Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints. Journal of Materials Science: Materials in Electronics (IF=1.569). 2015, 26(5):2674-2681. Wei Liu, Rong An*, Ying Ding, Chun-Qing Wang, Yan-Hong Tian, Kun Shen. Microstructure and property of AgCu/2wt% Ag added Sn-Pb solder/CuBe joints fabricated by vapor phase soldering. Rare Metals (IF=1.009). DOI 10.1007/s12598-015-0545-y, 2015. In Press Hailong Li, Rong An*, Chunqing Wang, Zhi Jiang. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging. Journal of Alloys and Compounds (IF=2.99). 2015, 634:94-98. Hailong Li, Rong An*, Chunqing Wang, Yanhong Tian, Zhi Jiang. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints. Materials Letters (IF=2.489). 2015, 144:97-99. Jiandong Zhu, Rong An, Chunqing Wang, Guangwu Wen. Fabrication of Al2O3-Mullite-AlN Multiphase Ceramic Layer on W-Cu Substrates for Power Semiconductor Packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology (IF=1.18). 2015, 5(2):182-187. Wei Liu, Rong An, Chunqing Wang and Yanhong Tian. Effect of Au-Sn IMCs' formation and morphologies on shear properties of laser reflowed micro-solder joints. Soldering & Surface Mount Technology (IF=0.872), 2015, 27(1):45-51. Rong An, Yanhong Tian, Lingchao Kong, Chunqing Wang, Shuai Chang. Laser-ignited Self-propagating Behavior of Self-supporting Nano-scaled Ti/Al Multilayer Films. Acta Metallurgica Sinica -Chinese Edition (IF=0.54), 2014, 50(8):97-943. Jiandong Zhu, Rong An, Chunqing Wang, Yanhong Tian,Guangwu Wen. A novel Method to Fabricate AlN-Al2O3 Multiphase Ceramic Layer on WCu Alloy. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014. Rong An, Huiwen Ma, Hailong Li, Zhen Zheng, Chunqing Wang. Formation of single phase Cu-Sn IMCs via layer-by- layer electroplating of Cu and Sn metals. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014. Rong An, Yanhong Tian, Chunqing Wang. Effect of modulation structure on the laser-ignited self-propagating behavior of Ti/Al multilayer films. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014. Rong An, Di Xu, Chunqing Wang. Parallel-gap resistance welding between gold-plated silver interconnects and silver electrodes in germanium solar cells. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014.
