个人简历

教育背景\r
2008年本科毕业于上海交通大学，获材料科学与工程专业学士学位\r
2015年研究生毕业于上海交通大学，获材料物理与化学专业博士学位\r
工作经历\r
2015至今，中南大学机电工程学院 微系统制造科学与工程系 讲师

研究领域

1) 微电子封装互连的制造及可靠性 \r
2) 表面微纳结构的高效制造及功能应用 ""

近期论文

Ganglong Li, Guang Zheng, Zijun Ding, Lei Shi, Junhui Li, Zhuo Chen, Liancheng Wang, Andrew A. O. Tay, and Wenhui Zhu, High-performance ultra-low-k fluorine-doped nanoporous organosilica ?lms for interlayer dielectric, J Mater Sci, 2018\r
Junhui Li, Haoliang Zhang, Can Zhou, Zhuo Chen, Xinxin Chen, Zhili Long, Xiaohe Liu, Wenhui Zhu, A multi-parameter numerical modeling and simulation of the dipping process in microelectronics packaging, IEEE T Ind Inform, In Press\r
Wenhui Zhu, Hanjie Yang, and Zhuo Chen*, Superior electromigration resistance of a microsized solder interconnection containing a single-Sn grain, Appl Phys Lett, 2018\r
Bo Wu, Shuanghai Zhang, Fuliang Wang, and Zhuo Chen*, Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding, J Electron Pack, 2018\r
Zhuo Chen, Wenya Tian, Junhui Li, and Wenhui Zhu, Intermetallic Growth Induced Large-Scale Void Growth and Cracking Failure in Line-Type Cu/Solder/Cu Joints Under Current Stressing, J Electron Mater, 2018.\r
Ganglong Li, Houya Wu, Honglong Luo, Zhuo Chen*, Andrew A. O. Tay, and Wenhui Zhu, Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation, AIP Adv, 2017, 7(9):095320.\r
Xinyao Yi, Zhixuan Lu, Yu Kong, and Zhuo Chen*, Label-Free Electrochemical Detection of MicroRNAs via Intercalation of Hemin into the DNA/RNA Hybridization, Int J Electrochem Sci, 2017, 12(4):2813-2821.\r
Zhuo Chen, Xianhe Zhang, Xian Fang, Hu He, and Wenhui Zhu, 2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016, pp. 1222-1225.\r
Zhuo Chen, Hu He, Anmin Hu, and Ming Li, Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, 2015, pp. 1497-1500.\r
Shixin Gao, Zhuo Chen, Anmin Hu, Ming Li, and Kaiyou Qian, Electrodeposited Ni microcones with a thin Au film bonded with Au wire, J Mater Process Technol, 2014, 214(2):326-333.\r
Qin Lu, Zhuo Chen, Wenjing Zhang, Anmin Hu, and Ming Li, Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones, Appl Surf Sci, 2013, 268:368-372.\r
Zhuo Chen, Tingbi Luo, Tao Hang, Ming Li, and Anmin Hu, Enhanced Ni3Sn4 nucleation and suppression of metastable NiSn3 in the solid state interfacial reactions between Sn and cone-structured Ni, CrystEngComm, 2013, 15(48):10490.\r
Zhuo Chen, Feifei Tian, Anmin Hu, and Ming Li, A facile process for preparing superhydrophobic nickel films with stearic acid, Surf Coat Tech, 2013, 231:88-92.