个人简历

工作和学习经历：\r
\r
2010年至今，教育部新世纪优秀人才，浙江大学信息与电子工程学院，电磁信息与电子集成创新研究所副所长，教授，博士生导师；\r
\r
2015年，美国伊利诺伊大学厄巴纳-香槟分校（UIUC）访问教授；\r
\r
2013年，韩国高等科技大学（Korea Advanced Institute of Science and Technology，KAIST）访问教授；\r
\r
2001年-2010年，新加坡国家高性能计算科学研究院（Singapore Institute of High Performance Computing）研究科学家；\r
\r
1998年－2001年，西安电子科技大学电磁场与微波技术专业，博士研究生；\r
\r
1995年－1998年，西安电子科技大学电磁场与微波技术专业，硕士研究生；\r
\r
1991年－1995年，西安电子科技大学微波通信工程系，工学学士。

研究领域

高速电路电磁干扰分析 天线与射频电路分析 深度学习在电磁建模、设计中的应用研究""

近期论文

[1] Y. F. Shu, X. C. Wei(魏兴昌), R. Yang, and E. X. Liu, “An Iterative Approach for EMI Source Reconstruction Based on Phaseless and Single-Plane Near-Field Scanning,” IEEE Trans. Electromagn.Compat., vol. 60, no. 4, pp. 937-944, 2018.\r
[2] J. Li, X. C. Wei(魏兴昌),Y .S. Shu,'Equivalent Radiation Source of 3D Package for Electromagnetic Characteristics Analysis,' Journal of Semiconductors, vol. 38, no. 10, pp.105-110, 2017.\r
[3] L. Gao, X. C. Wei(魏兴昌), Y. T. Huang, B. Li, and Y. F. Shu, 'Analysis of Near-Field Shielding Effectiveness for the SiP Module,' IEEE Trans. Electromagn.Compat., vol. 60, no. 1, pp. 288-291, 2018.\r
[4] W. Y. Ding, X. C. Wei(魏兴昌), D. Yi, and Y. F. Shu, “A Closed-Form Solution for the Impedance Calculation of Grid Power Distribution Network,” IEEE Trans. Electromagn.Compat., vol. 59, no. 5, pp.1449-1456, 2017.\r
[5] B. Shen, Y. Li, D. Yi, W. Zhai, X. Wei(魏兴昌), and W. Zheng, “Strong flexible polymer/graphene composite films with 3D saw-tooth folding for enhanced and tunable electromagnetic shielding,” Carbon, vol. 113, pp. 55-62, 2017.\r
[6] D. Yi, X. C. Wei(魏兴昌), and Y. L. Xu, “A Transparent Microwave Absorber Based on Patterned Graphene: Design, Measurement, and Enhancement,” IEEE Trans. Nanotechnol., vol. 16, no. 3, pp. 484-490, 2017.\r
[7] D. Yi, X. C. Wei(魏兴昌), and Y. L. Xu, “Tunable Microwave Absorber Based on Patterned Graphene,” IEEE Trans. Microwave Theory Techn., vol. 65, no. 8, pp. 2819-2826, 2017.\r
[8] J. B. Zhang, X. C. Wei(魏兴昌), Y. F. Shu, X. Q. Yu, and Y. L. Xu,'A Novel Coplanar Common-Mode Filter with a Wide Stopband,' IEEE Trans. Electromagn. Compat., vol. 59, no. 1, pp. 77-83, 2017.\r
[9] L. L. Yang, X. C. Wei(魏兴昌), D. Yi, and J. M. Jin, “A Bandpass Frequency Selective Surface with a Low Cross-Polarization Based on Cavities with a Hybrid Boundary,” IEEE Trans. Antennas Propagat., vol. 65, no.2, pp.654-661, 2017.\r
[10] B. Shen, Y. Li, D. Yi, W. T. Zhai, X. C. Wei(魏兴昌), and W. G. Zheng, “Microcellular Graphene Foam for Improved Broadband Electromagnetic Interference Shielding,” Carbon, vol. 102, pp. 154-160, 2016.\r
[11] Y. Li, B. Shen, X. L. Pei, Y. G. Zhang, D. Yi, W. T. Zhai, L. H. Zhang, X. C. Wei(魏兴昌), and W. G. Zheng, “Ultrathin Carbon Foams for Effective Electromagnetic Interference Shielding,” Carbon, vol. 100, pp. 375-385, 2016.\r
[12] J. Li, X. C. Wei(魏兴昌), and E. P. Li, “Accurate Field-Circuit Hybrid Modeling of High-Density Through Glass Via Arrays by using Perfect Magnetic Conductors and Cylindrical Mode Expansion,” IEEE Trans. Comp. Packag. Manufact Technol., vol. 6, no. 1, pp. 100-107, 2016.\r
[13] Y. L. Xu, E. P. Li, X. C. Wei(魏兴昌), and D. Yi, “A Novel Tunable Absorber Based on Vertical Graphene Strips,” IEEE Micro. Wireless Comp. Lett., vol. 26, no. 1, pp. 10-12, 2015.\r
[14] Y. L. Xu, X. C. Wei(魏兴昌), and E. P. Li, “Three-Dimensional Tunable Frequency Selective Surface Based on Vertical Graphene Micro-Ribbons,” Journal Electromagn. Waves Applicat., vol. 29, no. 16, pp. 2130-2138, 2015.\r
[15] F. P. Xiang, E. P. Li, X. C. Wei(魏兴昌), and J. M. Jin, “A Particle Swarm Optimization-Based Approach for Predicting Maximum Radiated Emission from PCBs with Dominant Radiators,” IEEE Trans. Electromagn. Compat., vol. 57, no. 5, pp. 1197-1205, 2015.\r
[16] Z. X. Liang, D. C. Yang, X. C. Wei(魏兴昌), and E. P. Li, “Dual-Band Dual Circularly Polarized Microstrip Antenna with Two Eccentric Rings and an Arc-Shaped Conducting Strip,” IEEE Antennas Wireless Propagat. Lett., vol. 15, pp. 834-837, 2015.\r
[17] Y. F. Shu, X. C. Wei(魏兴昌), X. Q. Yu, Y. S. Li, and E. P. Li, “A Compact Meander Line-Resonator Hybrid Structure for Wideband Common Mode Suppressions,” IEEE Trans. Electromagn. Compat., vol. 57, no. 5, pp. 1255-1261, 2015.\r
[18] F. P. Xiang, X. C. Wei(魏兴昌), and E. P. Li, “A Hybrid Domain Decomposition and Optimization Method for Predicting Electromagnetic Emissions from Printed Circuit Boards,” Journal Electromagn. Waves Applicat., vol. 29, no. 8, pp. 1082-1092, 2015.\r
[19] J. Li, X. C. Wei(魏兴昌), X. J. Wang, H. C. Yu, D. C. Yang, R. Hao, and E. P. Li, “Double-Shielded Interposer with Highly Doped Layers for High-Speed Signal Propagation,” IEEE Trans. Electromagn. Compat., vol. 56, no. 5, pp. 1210-1217, 2014.\r
[20] G. X. Luo, E. P. Li, X. C. Wei(魏兴昌), X. Cui, and R. Hao, “PDN Impedance Modeling for Multiple Through Vias Array in Doped Silicon,” IEEE Trans. Electromagn. Compat., vol. 56, no. 5, pp. 1202-1209, 2014.\r
[21] X. C. Wei(魏兴昌), Y. L. Xu, N. Meng, Y. Xu, A. Hakro, G. L. Dai, R. Hao, and E. P. Li, “A Non-Contact Graphene Surface Scattering Rate Characterization Method at Microwave Frequency by Combining Raman Spectroscopy and Coaxial Connectors Measurement,” Carbon, vol. 77, pp. 53-58, 2014.\r
[22] G. X. Luo, X. C. Wei(魏兴昌), R. Hao, X. Cui, and E. P. Li, “Full RLGC Model Extraction of Through Silicon Via (TSV) with Charge Distribution Effects,” Journal Electromagn. Waves Applicat., vol. 28, no. 13, pp. 1596-1609, 2014.\r
[23] X. L. Peng, and X. C. Wei(魏兴昌), “The Resonance Principle and Designing Method of Multi-Bands Microstrip Antenna with Branch Shape,” Journal Antennas, vol. 2, no. 4, pp. 21-26, 2013.\r
[24] D. C. Yang, J. Y. Xie, M. Swaminathan, X. C. Wei(魏兴昌), and E. P. Li, “A Rigorous Model for Through-Silicon Vias with Ohmic Contact in Silicon Interposer,” IEEE Micro. Wireless Comp. Lett., vol. 23, no. 8, pp. 385-387, 2013.\r
[25] D. C. Yang, X. C. Wei(魏兴昌), X. C. Zhang, L. S. Zhang, and E. P. Li, “A Novel Hybrid Analytical Method for Impedance Calculation of Power and Ground Planes,” IEEE Trans. Electromagn. Compat., vol. 55, no. 5, pp. 21-26, 2013.\r
[26] X. C. Wei(魏兴昌), D. C. Yang, and E. P. Li, “Integral Equation Technique for the Simulation of Signal Integrity and Power Integrity,” Frequenz, vol. 65, no. 9-10, pp. 279-285, 2011.\r
[27] Z. Z. Oo, E. X. Liu, X. C. Wei(魏兴昌), Y. J. Zhang, and E. P. Li, “Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages”, IEEE Trans. Comp. Packag. Technol., vol. 1, no. 9, pp.1428-1437, Sept. 2011.\r
[28] V. P. Bui, X. C. Wei (魏兴昌),E. P. Li, and W. J. Zhao, 'An efficient hybrid technique for analysis of the electromagnetic field distribution inside a closed environment,' Progress in Electromagnetics Research, vol. 114, pp.301-315, 2011.\r
[29] G. P. Zou, X. C. Wei（魏兴昌）, E. P. Li, X. Cui, and W. D. Zhang, 'Modeling of the Simultaneous Switching Noise in High Speed Electronic Circuit with the Integral Equation Method and Vector Fitting Method,' IEEE Trans. Magnetics, vol. 47, no. 5, pp.1490-1493, May 2011.\r
[30] 邹国平，崔翔，魏兴昌，李尔平，“高速电路电源/地层间阻抗参数计算与分析，” 电波科学学报，第二期，2011年.\r
[31] V. P. Bui, X. C. Wei(魏兴昌), E. P. Li, 'An efficient simulation technology for characterizing the ultra-wide band signal propagation in a wireless body area network,' J. of Electromagn. Waves and Appl., vol. 24, no. 17-18, pp2575-2588, Dec. 1, 2010.\r
[32] X. C. Wei（魏兴昌）, G. P. Zou, E. P. Li, and X. Cui, 'Extraction of Equivalent Network of Arbitrarily Shaped Power-Ground Planes with Narrow Slots using a Novel Integral Equation Method,' IEEE Trans. Microwave Theory Tech., vol. 58, no. 11, pp.2850-2855, Nov. 2010.\r
[33] X. C. Wei（魏兴昌）, Z. G. Shi, and E. P. Li, 'A Novel Combined Equivalent Networks Analysis for Power and Ground Planes with Narrow Slots', IEEE Trans. Electromagn. Compat., vol. 52, no. 4, pp.994-1000, Nov. 2010.\r
[34] X. C. Wei（魏兴昌） and E. P. Li, “Integral-equation equivalent-circuit method for modeling of noise coupling in multilayered power distribution networks,” IEEE Trans. Microwave Theory Tech., vol. 58, no. 3, pp.559-565, Mar. 2010.\r
[35] G. P. Zou, E. P. Li, X. C. Wei*（魏兴昌）, G. X. Lou, and X. Cui, “A new hybrid field-circuit approach to model the power-ground planes with narrow slot,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp.340-345, May 2010.\r
[36] Y. J. Zhang, Z. Z. Oo, X. C. Wei（魏兴昌）, E. X. Liu, E. P. Li, and J. Fan, “Systematic microwave network analysis for multilayer printed circuit boards with vias and decoupling capacitors,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp.401-409, May 2010.\r
[37] E. P. Li, X. C. Wei（魏兴昌）, A. C. Cangellaris, E. X. Liu, Y. J. Zhang, M. D’Amore, J. Kim, and T. Sudo, “Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp.248-265, May 2010.（Invited Paper）\r
[38] P. Bai, M. X. Gu, X. C. Wei（魏兴昌）, and E. P. Li, “Electrical detection of plasmonics waves using an ultra-compact structure via a nanocavity,” Opt. Express, vol. 17, no. 26, pp.24349-24357, Dec. 2009.\r
[39] E. X. Liu, E. P. Li, Z. Z .Oo, X. C. Wei（魏兴昌）, Y. J. Zhang, and R. Vahldieck, “Novel methods for modeling of multiple vias in multilayered parallel-plate structures,” IEEE Trans. Microwave Theory Tech., vol. 57, no. 7, pp. 1724-1733, 2009.\r
[40] Z. Z. Oo, E. P. Li, X. C. Wei（魏兴昌）, E. X. Liu, Y. J. Zhang, and L. W. Li, “Hybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network,” IEEE Trans. Electromagn. Compat., vol. 51, no.3, Part2, pp.784-791, Aug. 2009.\r
[41] X. C. Wei（魏兴昌）, E. P. Li, Y. L. Guan, and Y. H. Chong, “Simulation and experimental comparison of different coupling mechanisms for the wireless electricity transfer”, J. of Electromagn. Waves and Appl., vol. 23, no. 7, pp. 925-934, 2009.\r
[42] X. C. Wei（魏兴昌）, E. P. Li, E. X. Liu, and R. Vahldieck, “Efficient simulation of power distribution network by using integral equation and modal decoupling technology,” IEEE Trans. Microwave Theory Tech., vol. 56, no. 10, pp. 2277-2285, Oct. 2008.\r
[43] X. C. Wei（魏兴昌）, E. P. Li, E. X. Liu, E. K. Chua, Z. Z. Oo, and R. Vahldieck, “Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method,” IEEE Trans. Adv. Packag., vol. 31, no. 3, pp. 536-543, Aug. 2008.\r
[44] X. C. Wei（魏兴昌）, E. P. Li, E. X. Liu, and X. Cui, “Efficient modeling of re-routed return currents in multilayered power-ground planes by using integral equation,” IEEE Trans. Electromagn. Compat., vol.50 , no. 3, pp. 740-743, Aug. 2008.\r
[45] Z. Z. Oo, E. X. Liu, E. P. Li, X. C. Wei（魏兴昌）, Y. J. Zhang, Tan, M., L. W. Joshua Li, R. Vahldieck, “A Semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias,” IEEE Trans. Adv. Packag., vol. 31, no. 2, pp. 267-274, May 2008.\r
[46] X. C. Wei（魏兴昌） and E. P. Li, “Transmitting antenna’s reflected power and its influence on reverberation chamber calibration,” IEEE Trans. Electromagn. Compat., vol. 49, no. 1, pp. 192-194, Feb. 2007.\r
[47] E. P. Li and X. C. Wei（魏兴昌）, “Reverberation chamber for EMC testing,” Interference Technology, Aug. 2007, online available: http://www.interferencetechnology.com/articles/articles/article/reverberation-chamber-for-emc-testing.html.\r
[48] X. C. Wei（魏兴昌） and E. P. Li, “Efficient EMC simulation of enclosures with apertures residing in an electrically large platform using the MM-UTD method,” IEEE Trans. Electromagn. Compat., vol.47, no.4, pp.717-722, Nov. 2005.\r
[49] X. C. Wei（魏兴昌）, E. P. Li, and Y. J. Zhang, “Efficient solution to the large scattering and radiation problem using the improved finite element-fast multipole method,” IEEE Trans. Magn., vol. 41, no.5, pp.1684-1687, May 2005.\r
[50] X. C. Wei（魏兴昌）, Y. J. Zhang, and E. P. Li, “The hybridization of fast multipole method with asymptotic waveform evaluation for the fast monostatic RCS computation,” IEEE Trans. Antennas Propagat., vol. 52, no. 2, pp.605-607, Feb. 2004.\r
[51] X. C. Wei（魏兴昌）, E. P. Li, and Y. J. Zhang, “Application of the improved finite element-fast multipole method on large scattering problems,” Progress in Electromagnetics Research, vol. 47, pp. 49-60, 2004.\r
[52] Y. J. Zhang, X. C. Wei（魏兴昌）, and E. P. Li, “Electromagnetic scattering from three-dimensional bianisotropic objects using hybrid finite element-boundary integral method,”J. Electromagn. Waves And Appl. Vol. 18, no.11, pp.1549-1563, 2004.\r
[53] X. C. Wei（魏兴昌） and E. P. Li, “Wide-band EMC analysis of on-platform antennas using impedance matrix interpolation with the moment method-physical optics method,” IEEE Trans. Electromagn. Compat., vol. 45, no.3, pp.552-556, Aug. 2003.\r
[54] X. C. Wei（魏兴昌）, E. P. Li, and C. H. Liang, “Fast solution for large scale electromagnetic scattering problems using wavelet transform and its precondition,” J. Electromagn. Waves And Appl., vol.17, no.4, pp.611-613, Apr. 2003.\r
[55] X. Wei（魏兴昌）, E. Li, and C. Liang, “Wavelet method in the solution of magnetic field integral equations,” IEE Proc.-Sci. Meas. Technol., vol.149, no.5, pp.286-288, Sept. 2002.\r
[56] X. C. Wei（魏兴昌）, E. P. Li, and C. H. Liang, “A new MRTD scheme based on Coifman scaling functions for the solution of scattering problems,” IEEE Microw. Wireless Compon. Lett., vol. 12, no.10, pp.392-394, Oct. 2002.