个人简历

于湘涛，钢铁共性技术协同创新中心教师博士后，项目硕导。2012年在重庆大学冶金工程专业获学士学位，2018年在北京科技大学冶金工程专业获博士学位。目前主要从事能源电化学材料多结构、多尺度调控方面研究

近期论文

代表性学术论文
1. Xiangtao Yu, Mingyong Wang,* Xuzhong Gong, Zhancheng Guo, Zhi Wang,* and Shuqiang Jiao*，Self-Supporting Porous CoP-based Films With Phase-Separation Structure for Ultrastable Overall Water Electrolysis at Large Current Density[J]. Advanced Energy Materials, 2018, 1802445.
2. Xiangtao Yu, Zhangfu Yuan*, The Structure Evolution Mechanism of Ni Films Depending on Hydrogen Evolution Property During Electrodeposition Process[J]. Metallurgical and Materials Transactions B, 2019, 50B, 587-594.
3. Xiangtao Yu, Mingyong Wang*, Zhi Wang, Xuzhong Gong, Zhancheng Guo, Time-dependent surface structure evolution of NiMo films electrodeposited under supergravity field as electrocatalystfor hydrogen evolution reaction[J]. The Journal of Physical Chemistry C, 2017, 121 (7): 16792-16802.
4. MingyongWang*, Xiangtao Yu, Zhi Wang, Xuzhong Gong, Zhancheng Guo, Hierarchically 3D porous films electrochemically constructed on gas-liquid-solid three-phase interface for energy application, Journal of Materials Chemistry A[J]. 2017, 5: 9488-9513.
5. Xiangtao Yu, MingyongWang*, Zhi Wang, Xuzhong Gong, ZhanchengGuo, 3D multi-structural porous NiAg films with nanoarchitecture walls: high catalytic activity and stability for hydrogen evolution reaction[J]. Electrochimica Acta, 2016, 211: 900-910.
6. Xiangtao Yu, MingyongWang*, Zhi Wang, Xuzhong Gong, Zhancheng Guo*, The structure evolution mechanism of electrodeposited porous Ni films on NH4Cl concentration[J]. Applied Surface Science, 2016, 360: 502-509.
7. Zhangfu Yuan, Shanshan Xie, Xiangtao Yu*, Yangang Zhang, Rongyue Wang, Local corrosion mechanism of SiO2-based refractories caused by slag movement near solid–liquid–gas interface in different slag systems[J]. Transactions of Nonferrous Metals Society of China, 2019, 29: 1975−1982.
8. Zhangfu Yuan, Rongyue Wang, Xiangtao Yu*,Marangoni Convection Driving Bubble Behavior and Microstructure Evolution of Sn-3.5Ag/Sn-17Bi-0.5Cu Alloy Solidified on Cu Substrate under Space Microgravity Condition[J]. Metallurgical and Materials Transactions A, 2019, 50A: 5210-5220.