个人简历

毕业于吉林大学、东北大学和北京科技大学，分别获得工学学士、硕士和博士学位。

研究领域

1. 材料的晶体学织构理论与应用 2. 材料的微观结构与性能 3. 相变存储器材料"材料的织构与各向异性、材料微观结构表征和材料结构与性能在线检测技术等，包括材料在变形、再结晶和固态相变等过程中织构的形成与演化及对相关性能的影响，材料的织构与相关性能在线检测技术等"

近期论文

[1] W. Li, L. Chen. The mechanism of texture evolution in annealed L10–FePt thin films. Applied Physics A, 2018,124: 100. https://doi.org/10.1007/s00339-017-1523-z [2] W. Li, L. Chen. Grain growth mechanism and magnetic properties in L10-FePt thin films. AIP Advances, 2017,7:085203 [3] W. Li, L. Chen. Sputtering pressure effects on microstructure and grain orientation distribution in FePt thin films. Journal of Materials Science: Materials in Electronics, 2017, 28:13579-13586 [4] Q. X. Yin, L. Chen. The correlation of electrical conductivity with the microstructure of Ge2Sb2Te5 thin films alloyed with Sn. Materials Research Express, 2017,4:016407 [5] Q. X. Yin, L. Chen. The mechanism of texture formation during crystallization process of Ge2Sb2Te5 thin films. Crystal Research and Technology, 2017,52:1600243 [6] J. Z. Hu, L. Chen. Effect of annealing on microstructure of Co/Cu multilayers. Journal of Materials Science: Materials in Electronics, 2015,26:3168-3173 [7] G. L. Xie, X. T. Wang, L. Chen. Microstructural modelling of dynamic recrystallisation in Nb microalloyed steels. Materials Science and Technology, 2012,28:778-782 [8] N. Pang, L. Chen. Effect of Substrate Orientation on Critical Thickness of Cu Thin Films. Electronic Materials Letters, 2011,7:359-363 [9] G. J. Yuan, L. Chen. Finite element simulation of hydrostatic stress in copper interconnects. Journal of Semiconductors, 2011,32:055011 [10] L. Chen, J. F. Zhang, L. Zhang, L. Meng. Textures of high-strength low-expansion Fe-Ni alloys wire during cold-drawing processes. International Journal of Minerals, Metallurgy and Materials, 2009,16:667-671