个人简历

教育背景：\r
2003.6 在新加坡南洋理工大学 获博士学位\r
1994.6 在天津大学力学系,获工学硕士学位\r
1991.7 从中国科学技技术大学近代力学系 获理学学士学位\r
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工作背景：\r
2006.2- 至今 北航航空科学与工程学院固体力学研究所 （飞机强度系）\r
2003. 8 –2006.1 在新加坡制造工艺研究所 (Singapore Institute of Manufacturing Technology - SimTech)，电子封装与微连接技术组工作 (高级研究工程师)\r
1994.7－1999.11 北京航空材料研究院无损检测室工作

研究领域

人体生物力学\r
复合材料的细观损伤及失效机制（以扫描电镜下的原位观察和数值分析为主）\r
半导体器件在力-热-电多物理场作用下的可靠性问题及其实验和数值分析方法""

近期论文

Microscopic Mechanism of the High-Temperature Strength Behaviour of a C/SiC Composite.[期刊]:Applied Composite Materials\r
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In?uence of interfacial bonding conditions on the antipenetration performance of ceramic/metal composite targets.[期刊]:Int J Mech Mater Des\r
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Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip:Review of Scientific Instruments\r
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An observation and explanation of interior cracking at the interface of solder by electromigration.[期刊]:Microelectronics Reliability\r
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et al, Wu J, Huang P,Su F.Creep behavior of C/SiC composite in hot oxidizing atmosphere and its mechanism[J]. Ceramics International, 2017.\r
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et al, Huang P, Pan X,Su F.Influence of Copper Pumping on Integrity and Stress of Through-Silicon Vias[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(8): 1221-1225.\r
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Xiaoxu Pan, Tianbao Lan,Fei Su.Stress evaluation of through-silicon vias using micro-infrared photoelasticity and finite element analysis. Optics and Lasers in Engineering, Vol.74(11), Pages 87–93, 2015.\r
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et al, Lan T B, Li W J,Su F.Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package. Journal of Mechanics, Vol. 30(06): 625-630, 2014.\r
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et al, Wang Y, Zhang Z,Su F.Study of Electromigration-induced Stress of Solder. Journal of Electronic Packaging, 2014\r
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Su F.Methodology for the Stress Measurement of Ferromagnetic Materials by Using Magneto Acoustic Emission. Experimental Mechanics, Vol.54(8): 1431-1439, 2014.\r
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Fei Su*, Tianya Bian, Jun Kang, Zhidong Guan,Junwu Mu.Error analysis of phase shifting by varying the incident angle of parallel beams in shadow Moiré. Optik, Vol.24(24), Pages 6769–6771, 2013.\r
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et al, Xiong J, Mao R,Su F.On thermo-mechanical reliability of plated-through-hole (PTH). Microelectronics Reliability, Vol. 52(6): 1189-1196, 2012.\r
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et al, Wang X, Mao R,Su F.Creep behaviour of Sn–3.8 Ag–0.7 Cu under the effect of electromigration: Experiments and modeling. Microelectronics Reliability, Vol.51(5): 1020-1024, 2011.\r
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Su Fei.Evaluation of residual stress in flip chip using 3-D optical Interferometry/FEM hybrid technique. Strain, Vol.43(4): 289-298, 2007.\r
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Yi S, Chian K S,Fei Su.An optical technique to characterize hygroscopic expansion and its effects on plastic Packages. Microelectronics Reliability, Vol. 46: 600-609, 2006.\r
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Liu Yu Chan, Wei Jun,Su Fei.Removal of AFM moiré Measurement Error due to Non-linear Scan and Creep of Probe. Journal of Nanotechnology, Vol.16 (9), pp 1681-1686 . 2005.\r
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Dai Fulong, Cherm Sin Chian,Su Fei.Development and instrumentation of an integrated three–dimensional optical testing system for application in integrated circuit packaging. Review of Scientific Instrument. Vol.76 (9), 2005.\r
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Su Fei.Development of an integrated optical system for warpage and hermeticity test of microdisplay. Optics and Lasers in Engineering, Vol.74(11), Pages 87–93, 2005.\r
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Yi Sung, Chian Kerm Sin, Dai Fulong,Su Fei.Simultaneous Recording of Fringe Patterns with one Camera. Journal of Acta Mechnica Sinica, Vol. 20(6) pp.613-622, 2004\r
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Yi Sung, Chian Kerm Sin, Sun Yaofeng,Su Fei.Use of Wollaston Prism to Simplify the Polarization Method for Simultaneous Recording of Moiré Interferometry Fringe Patterns. Optical Engineering, Vol.43 (12), pp.3003-3007, 2004.\r
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Chian Kerm Sin, Yi Sung,Su Fei.A Simple Method to Unwrap the Geometrically Discontinuous Phase Map and Its Application in the Measurement of IC Package. Optics and Lasers in Engineering, Vol.41, pp 463-473. 2004.\r
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F* (corresponding author). (2017), & Su, Q., Wang, X., Pan, Q., Liu, Z.,Zhang.Influence of stress on the electromigration life of solder. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(5), 762-767.
中国力学学会实验力学专业委员会委员和《实验力学》编委