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王为
2023-05-22 15:49
  • 王为
  • 王为 - 教授/系主任-天津大学-化工学院-个人资料

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近期论文


Synthesis and Characterization of CNTs/Bi2Te3 Thermoelectric Nanocomposites. Int. J. Electrochem. Sci., 2013, (8): 6686 – 6691
Electrodeposition of MWNT/Bi2Te3 Composite Thermoelectric Films. Journal of Elec Materi, 2013, 42:1936-1945
Effect of MWNTs on the Electrochemical Reduction Processes of Bi3+, HTeO2+, and Their Mixtures. Journal of Elec Materi, 2013, 42:2073-2083
Microstructure and thermoelectric properties of p-type Bi - Sb - Te - Se thin films prepared by electrodeposition method. Thin Solid Films, 2012, 520(7): 2474-2478
Investigation on the Cu(II) and Co(II) Electrochemical Reduction Process in Citrate Solution by CV and EIS. Journal of The Electrochemical Society, 2012, 159 (6): D375-D381
Electrodeposition of p-type BixSb2-xTey Thermoelectric Film from Dimethyl Sulfoxide Solution. Electrochimica Acta, 2010, 55(17): 5000-5005
Electrodeposition of BixSb2-xTey Thermoelectric Films from DMSO Solution. Journal of Electronic Materials, 2010, 39(9): 1562-1565
Studies on the electrochemical reduction processes of HTeO2+ by CV and EIS. Journal of Applied Electrochemistry, 2010, 40(11): 2005-2012
Effect of Substrate on the Structure and Thermoelectric Properties of n-Type Bi2Te3_ySey Thin Films Prepared by Electrodeposition. Journal of Eelectric Materials, 2010, 39(9):1469-1475
Adsorption Behavior and Related Mechanism of Janus Green B during Copper Via-Filling Process.JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156(4): D119-D124
Invalidating Mechanism of Bis (3-sulfopropyl) Disulfide (SPS) During Copper Via-filling Process. APPLIED SURFACE SCIENCE, 2009, 255(8): 4389-4392
Investigations on the Invalidated Process and Related Mechanism of PEG During Copper Via-filling Process. APPLIED SURFACE SCIENCE, 2009, 255(7): 3977-3982
Studies of the Electrochemical Reduction Processes of Bi3+, HTeO2+ and Their Mixtures. APPLIED SURFACE SCIENCE, 2009, 255(16):7394-7402
Investigations on the Electrodeposition Behaviors of Bi0.5Sb1.5Te3 Thin Film From Nitric Acid Baths. ELECTROCHIMICA ACTA, 2009, 54(14): 3745-3752
Electrochemical Reduction Process of Sb(III) on Au Electrode Investigated by CV and EIS. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156(3):D84-D91
Electrodeposition of BixSb2-xTey Thermoelectric Thin Films From Nitric Acid And Hydrochloric Acid Systems. APPLIED SURFACE SCIENCE, 2009, 255(7):4225-4231
Effect of Clon the Adsorption-Desorption Behavior of PEG. J. Electrochem. Soc., 2008, 155(4): D263-D269.
Effect of the Substrate on the Electrodeposition of Bi2Te3-ySey Thin Films. Materials Research Bulletin, 2008, 43(7): 1808-1813
Electrodeposition of n-type Bi2Te3-ySey Thermoelectric Thin Films on Stainless Steel and Gold Substrates. APPLIED SURFACE SCIENCE, 2007, 253 (6): 3360-3365
Effect of the Dispersibility of ZrO2 Nanoparticles in Ni-ZrO2 Electroplated Nanocomposite Coatings on the Mechanical Properties of Nanocomposite Coatings. APPLIED SURFACE SCIENCE,2006,252 (10): 3812-3817
A New Type of Low Power Thermoelectric Micro-generator Fabricated by Nanowire Array Thermoelectric Materials. Microelectronic Engineering, 2005, 77(3-4):223-229.
Fabrication and Characterization of Ni-ZrO2 Composite Nano-coatings by Pulse Electrodeposition. Scripta Materialia, 2005, 53:613-618
Electrodeposition of Bismuth Telluride on Gold from Acidic Solutions. BULLETIN OF ELECTROCHEMISTRY, 2005, 21 (10): 471-479
Electrochemically Assembled p-type Bi2Te3 Nanowire Arrays. JOURNAL OF APPLIED PHYSICS, 2004, 96(11):615-618.
XPS, UPS and ESR Studies on the Interfacial Interaction in Ni-ZrO2 Composite Plating ”. Journal of Materials Science, 2000, 35: 1495-1499.
白金电极上での次亚リン酸ィォンの酸化反应. 表面技術,1995,46(5)62-67。
酸性溶液中における无电解ニッケルめつき皮膜の水素发生举动. 表面技術,1995,46(3):76-77。

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