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戴剑博
2023-05-17 11:42
  • 戴剑博
  • 戴剑博 - 博士 讲师-中国矿业大学-机电工程学院-个人资料

近期热点

资料介绍

个人简历


戴剑博,博士,中国矿业大学讲师。2020年4月于南京航空航天大学取得工学博士学位。2016年11月至2017年11月获得国家公派(CSC)资助赴美国密歇根大学联合培养一年。2020年5月起任职于中国矿业大学机电学院。近5年以第一作者发表学术论文6篇(SCI收录期刊5篇)。期刊主要包括:Ceramics International,International Journal of Mechanical Sciences,Journal of Manufacturing Processes,Precision Engineering, International Journal of Advaced Manufacturing Technolgy。
获奖情况:
1. 2018博士研究生国家奖学金;
2. 2018高效精密加工研究所“科研之星”
3. 2016留学基金委奖学金;
承担项目:
1.国家自然科学基金“基于化学机械效应的单层超硬磨料砂轮临界干涉修整技术基础研究”,No. 51275231,2015年4月至2016年12月,参与。
2.南京航空航天大学研究生创新基地开放基金资助项目“多颗磨粒磨削协同作用机理研究”,NO: kfjj20160522,2016年4月至2017年9月,主持。
3.校企合作项目“耐高温复合材料加工机理及加工方法研究“”,子课题:加工方式对Cf/SiC材料表面完整性及性能的影响规律2015年9月-2016年5月,参与。
4.校企合作项目“Coated Abrasive Polishing Of the Aluminium Alloy(Foxconn)”2016年11月至2017年10月,参与。

研究领域


煤矿高效智能开采装备及技术、超硬金刚石工具技术、超声辅助加工技术与装备,加工过程模拟与控制技术。""

近期论文


[1]Jianbo Dai,Honghua Su,Hao Hu,Tengfei Yu,Wenbo Zhou,Wenfeng Ding,Shijun Ji,Yihao Zheng,The influence of grain geometry and wear conditions on the material removal mechanism in silicon carbide grinding with single grain.Ceramics International,2017,43:11973-11980.(SCI)
[2]Jianbo Dai,Honghua Su,Wenbo Zhou,Wenfeng Ding,Quanli Zhang,Yihao Zheng,Finite element implementation of the tension-shear coupled fracture criterion for numerical simulations of brittle-ductile transition in silicon carbide ceramic grinding,International Journal of Mechanical Sciences,2018,146:211-220.(SCI)
[3]Jianbo Dai,Honghua Su,Wenbo Zhou,Quanli Zhang,Yihao Zheng,Experimental and Numerical investigation on the interference of diamond grains in double-grains grinding silicon carbide ceramics process,Journal of Manufacturing Processes,2019,44:408-417.(SCI)
[4]Jianbo Dai,Honghua Su,Tengfei Yu,Hao Hu,Wenbo Zhou,Wenfeng Ding,Experimental investigation on materials removal mechanism during grinding silicon carbide ceramics with single diamond grain.Precision Engineering,2018,51:271-279.(SCI)
[5]Jianbo Dai,Wenfeng Ding,Liangchi Zhang,Jiuhua Xu,Honghua Su,Understanding the effects of grinding speed and undeformed chip thickness on the chip formation in high-speed grinding.International Journal of Advaced Manufacturing Technolgy,2015,81:995-1005.(SCI)
[6]Honghua Su,Jianbo Dai,Wenfeng Ding,Kun Zhang,Wang Xu,Experimental research on performance of monolayer brazed diamond wheel through a new precise dressing method-plate wheel dressing.International Journal of Advanced Manufacturing Technology,2016,87:3249-3259.(SCI);
[7]戴剑博,苏宏华,周文博,于腾飞,单颗金刚石磨粒划擦多晶烧结碳化硅陶瓷试验研究,航空制造技术,2018,61:52-56.(中文核心期刊)
[8]Wenbo Zhou,Honghua Su,Jianbo Dai,Tengfei Yu,Yihao Zheng,Numerical investigation on the influence of cutting-edge radius and grinding wheel speed on chip formation in SiC grinding,Ceramics International,2018,44(17):21451-21460.(SCI)
[9]Yang Wang,Honghua Su,Jianbo Dai,Shubao Yang,A novel finite element method for the wear analysis of cemented carbide tool during high speed cutting Ti6Al4V process,International Journal of Advanced Manufacturing Technology,2016,87:3249-3259.(SCI)
[10]Yang Wang,Honghua Su,Gansen Lu,Jianbo Dai,Biao Zhao,Chenwei Dai,Yucan Fu,Quality prediction of plunger components based on the finite element method during the neck-spinning process,International Journal of Advanced Manufacturing Technology.(SCI)

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