近期论文
J.Q. Chen, J.D. Guo, K.L. Liu, J.K. Shang, Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints, J. Appl. Phys., 114: 15 (2013) 153509 H.F. Zhou, J.D. Guo, Q.S. Zhu, J.K. Shang, Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint, Journal of Materials Science & Technology 29:1 (2013) 7-12. H.F. Zhou, J.D. Guo, J.K. Shang, Electroless Deposition of Highly Solderable Fe-Ni Films. Journal of the Electrochemical Society 160: 6 (2013) D233-D239.H.Y. Liu, Q.S. Zhu, Z.G. Wang, J.D. Guo, J.K. Shang, Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect. Journal of Materials Science-Materials in Electronics, 24: 1 (2013) 211-216.H.F. Zhou, J.D. Guo, J.K. Shang, Microstructural Study of Interfacial Reactions between Liquid Sn and Electroless Fe-Ni Alloys, J. Electron. Mater., 41：11，(2012), 3161-3168. X.F. Zhang, H.Y. Liu, J.D. Guo, J.K. Shang, Inhibition of electromigration in eutectic SnBi solder interconnect by plastic prestraining, J. Mater. Sci. Tech., 27:11, (2011), 1072-1076. X.F. Zhang, J.D. Guo, J.K. Shang, Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate, J. Electron. Mater., 39:3 (2010) 333–337.X.F. Zhang, J.D. Guo, J.K. Shang, Growth kinetics of intermetallic compounds between Sn–9Zn solder and electroplated Fe–42Ni metallization, J. Alloy Comp., 487 (2009) 776–780.Q.L. Yang, P. J. Shang, J.D. Guo, Z. Q. Liu, J.K. Shang, Current-induced growth of P-rich phase at electroless nickel/Sn interface, J. Mater. Res., 24:9 (2009) 2767-2774.X.F. Zhang, J.D. Guo, J.K. Shang，Effects of electromigration on interfacial reactions in the Ni/Sn-Zn/Cu solder interconnect, J. Electron. Mater., 38:3. (2009). 425-429. X.G. Chen, G.H. He, J.H. Du, S.F. Pei, J.D. Guo, Investigation on the thermal conductivity of HDPE/MWCNT composites by laser pulse method, Science in china series E, 52:9, (2009)2767-2772.X.F. Zhang, J.D. Guo, J.K. Shang，Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition, J. Alloy Comp., 479 (2009), 505-510.X.N. Du, J.D. Guo, J.K. Shang, Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints, J. Electron. Mater., 38:11 (2009) 2398–2404。H.Y. Guo, J.D. Guo, J.K. Shang, Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces, J. Electron. Mater., 38:12 (2009) 2470–2478.X.F. Zhang, J.D. Guo, J.K. Shang，Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect, J. Mater. Res. 23 (2008), 3370-3378. X.N. Du, S.M. Yin, S.C. Liu, B.Q. Wang, J.D. Guo, Effect of the electropulsing on mechanical properties and microstructure of an ECAPed AZ31 Mg alloy, J. Mater. Res., 23:6 (2008) 1570-1577.X.Y. Wu, J.D. Guo, Electric-discharge compaction of graded WC–Co composites, Inter. J. Refract. Met. & Hard Mater. 26 (2008) 28–32.
