个人简历

研究领域

熱電材料、半導體製程、微冷凍元件、微電子封裝""

近期论文

Accepted P.-C. Wei, C. N. Liao, H.-J. Wu, D. Yang, J. He, G. V. Biesold-McGee, S. Liang, W.-T. Yen, X. Tang, J.-W. Yeh, Z. Lin, and J. H. He “Thermodynamic routes to ultra-low thermal conductivity and high thermoelectric performance”, Adv. Mater.
2020 C.-Y. Lan, C.-Y. Hsu, Y.-C. Lee, C. N. Liao* “Grain growth behavior and enhanced thermoelectric properties ofPbTe consolidated by high-density pulse current”, J. Alloys Comp., 815, 1526582.
2019 H.-H. Fan, W.-L. Weng, C.-Y. Lee, C. N. Liao* “Electrochemical Cycling-Induced Spiky CuxO/Cu Nanowire Array for Glucose Sensing”, ACS Omega, 4, 12222 – 12229.
2019 C.-L. Huang, W.-L. Weng, Y.-S. Huang C. N. Liao* ”Enhanced photolysis stability of Cu2O grown on Cu nanowires with nanoscale twin boundaries”, Nanoscale, 11, 13709 - 13713. DOI: 10.1039/c9nr01406c. (Outside Back Cover).
2018 Chun-Lung Huang, Wei-Lun Weng, Chien-Neng Liao*, K. N. Tu Nature Communications:Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
2018 W.-L. Weng, C.-Y. Hsu, J.-S. Lee, H.-H. Fan, C. N. Liao* “Twin-mediated epitaxial growth of highly lattice-mismatched Cu/Ag core–shell nanowires”, Nanoscale, 10, 9862-9866.
2018 J.-C. Hsiao, Y.-H. Chen, C. N. Liao* “Anisotropic thermal conductivity of sputtered Bi0.5Sb1.5Te3 films after current-assisted thermal treatment”, Thin Solid Films, 645, 93-96.
2018 C.-T. Li, Y.-H. Chen, C. N. Liao* “Electrically motivated atomic migration and defect formation in Bi0.5Sb1.5Te3 compounds”, Mater. Chem. Phys., 204, 373-377. (SCI)
2018 C.-L. Huang, W.-L. Weng, C. N. Liao*, K. N. Tu “Suppression of interdiffusion- induced voiding in oxidation of copper nanowires with twin-modified surface”, Nat. Commun. 9, 340.
2017 Y.-H. Chen and C. N. Liao* “Transport properties of electrically sintered bismuth antimony telluride with antimony nanoprecipitation”, Appl. Phys. Lett., 111, 143901.
2017 Y.-H. Chen and C. N. Liao* “Scattering characteristics of grain boundaries in electrically sintered Bi0.4Sb1.6Te3 compounds”, Mater. Lett., 197, 21-23.
2017 J.-S. Lee, W.-L. Weng, C. N. Liao* “Characterization and modeling of twinning superlattice structure in copper nanowires”, Mater. Lett., 194, 23-25.
2017 T. T. Shen, C. N. Liao* “Enhancement of fatigue resistance of Bi-Sb-Te films on flexible substrates by current-assisted thermal annealing”, Mater. Lett., 186, 314-317.
2016 H.-H. Huang, M.-P. Lu and C. N. Liao* “Transverse thermoelectric effect of asymmetrically doped Bi-Sb-Te compounds”, J. Appl. Phys., 119, 205101.
2016 Y.-T. Huang, C.-W. Huang, J.-Y. Chen, Y.-H. Ting, S.-L. Cheng, C.-N. Liao and W.-W. Wu “Mass transport phenomena in copper nanowires at high current density”, Nano Research, 9, 1071.
2016 H.-P. Chen, C.-W. Huang, C.-W. Wang, W.-W. Wu, C.-N. Liao, L.-J. Chen and K.-N. Tu, “Optimization of the nanotwin-induced zigzag surface of copper by electromigration”, Nanoscale, 8, 2584.
2015 M.-P. Lu, C. N. Liao*, J.-Y. Huang, H.-C. Hsu “Thermoelectric Properties of Ag-Doped Bi2(Se,Te)3 Compounds: Dual Electronic Nature of Ag-Related Lattice Defects”, Inorg. Chem., 54, 7438.
2015 C.-L. Huang and C. N. Liao* “Chemical reactivity of twin-modified copper nanowire surfaces”, Appl. Phys. Lett., 107, 021601.
2015 C.-J. Yang, C.-L. Huang and C. N. Liao* “Enhancing chemical stability of electroplated Cu films by engineering electrolyte chemistry and twinning structure”, J. Electron. Mat. 44, 2529.
2014 T. C. Chan*, Y. M. Lin*, H. W. Tsai*, C. C. Lin*, Z. M. Wang, C. N. Liao!, Y. L. Chueh! Growth of large-scale nanotwinned Cu nanowire arrays from anodic aluminum oxide membrane by electrochemical deposition process: Controllable nanotwin density and growth orientation with enhanced electrical endurance performance, Nanoscale, 6, 7332,
2014 H. W. Tsai*, T. H. Wang*, T. C. Chan*, P. J. Chen*, C. C. Chung*, A. Yaghoubi*, C. N. Liao, E. W.-G. Diau, Y. L. Chueh! Fabrication of Large Scale Single Crystal Bismuth Telluride (Bi2Te3) Nanosheet Arrays by Single Step Electrolysis Process, Nanoscale, 6, 7780,
2014 Y. L. Liu* and C. N. Liao! Experimental and theoretical assessments of thermal boundary resistance between Bi0.4Sb1.6Te3 thin films and metals, Appl. Phys. Lett., 105, 013903,
2014 P. H. Le*, C. N. Liao, C. W. Luo, J. Leu! Thermoelectric properties of nanostructured bismuth-telluride thin films grown using pulsed laser deposition, J. Alloys Comp. 615, 546–552,
2014 P.-J. Chen and C. N. Liao “Thermoelectric transport properties of BiTe based thin films on strained polyimide substrates”, Appl. Phys. Lett., 105, 133903.
2014 P.-J. Chen* and C. N. Liao! Thermoelectric transport properties of Bi-Te based thin films on strained polyimide substrates, Appl. Phys. Lett., 105, 133903,
2014 T.-C. Chan*, Y.-Z. Chen*, Y.-L. Chueh!, C. N. Liao! Large-scale nanotwins in copper films/Cu nanowires via stress engineering by high energy ion beam bombardment process: growth and characterization, J. Mater. Chem. C, 2, 9777-10038,
2013 C. N. Liao!, Y. C. Lu* and D. Xu Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition, J. Electrochem. Soc.,
2013 C. N. Liao!, C.-Y. Lin*, C.-L. Huang* and Y.-S. Lu* Morphology, Texture and Twinning Structure of Cu Films Prepared by Low-temperature Electroplating, J. Electrochem. Soc.,
2013 M.-P. Lu* and C. N. Liao! Mechanical and thermal processing effects on crystal defects and thermoelectric transport properties of Bi2(Se,Te)3 compounds, J. Alloys Compd.,
2013 H.-H. Huang*, M.-P. Lu*, C.-H. Chiu*, L.-C. Su*, C. N. Liao!, J.-Y. Huang, H.-L. Hsieh Enhanced Seebeck coefficient of bismuth telluride compounds with graded doping profiles, Appl. Phys. Lett.,
2013 P. H. Le*, C. N. Liao, C. W. Luo, J.-Y. Lin, J. Leu! Thermoelectric properties of bismuth-selenide films with controlled morphology and texture grown using pulsed laser deposition, Appl. Surf. Sci,
2012 T. Y. Lin, C. N. Liao, A. T. Wu “Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials”, J. Electron. Mat. 41, 153.
2011 S. S. Lin and C. N. Liao “Effect of ball milling and post treatment on crystal defects and transport properties of Bi2(Se,Te)3 compounds”, J. Appl. Phys., 110, 093707.
2011 T. C. Chan, Y. L. Chueh and C. N. Liao “Manipulating the crystallographic texture of nanotwinned Cu films by electrodeposition”, Cryst. Growth Des., 11, 4970.
2011 T. C. Chan, K. C. Chen and C. N. Liao “Surface roughness reduction of nanocrystalline Cu thin films by electrical stressing treatment”, Appl. Phys. Lett., 98, 181902.
2011 C. N. Liao, X. W. Su, K. M. Liou and H. S. Chu “Electrical and thermal transport properties of electrically stressed Bi-Sb-Te nanocrystalline thin films”, Thin Solid Films, 519, 4394.
2011 C. H. Lee, W. T. Chen and C. N. Liao “Effect of antimony on vigorous interfacial reaction of Sn-Sb/Te couples”, J. Alloys Compd., 509, 5142.
2010 C. N. Liao, W. T. Chen and C. H. Lee “Polarity effect on interfacial reactions at soldered junctions of electrically stressed thermoelectric modules”, Appl. Phys. Lett. 97, 241906.
2010 C. N. Liao, H. D. Shih and P. W. Su “Electrocrystallization of Mutually Crossed Bismuth Telluride Nanoplatelets”, J. Electrochem. Soc. 157, D605.
2010 K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu “Stability of nanoscale twins in copper under electric current stressing”, J. Appl. Phys. 108, 066103.
2010 K. M. Liou and C. N. Liao “Electric current enhanced defect elimination in thermally annealed BiSbTe and BiSeTe thermoelectric thin films”, J. Appl. Phys., 108, 053711.
2010 C. N. Liao, C. Y. Chang and H. S. Chu “Thermoelectric properties of electrically stressed Sb/Bi–Sb–Te multilayered films”, J. Appl. Phys., 107, 066103.
2010 C. N. Liao and Y. C. Huang “Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium”, J. Mat. Res., 25, 391.
2010 C. N. Liao, L. C. Wu and J. S. Lee “Thermoelectric properties of Bi-Sb-Te materials prepared by electric current stressing”, J. Alloys Compd., 490, 468.
2009 C. N. Liao and L. C. Wu “Enhancement of carrier transport properties of BixSb2-xTe3 compounds by electrical sintering process”, Appl. Phys. Lett., 95, 052112.
2008 C. N. Liao, Y. C. Wang and H. S. Chu “Thermal transport properties of nanocrystalline Bi–Sb–Te thin films prepared by sputter deposition”, J. Appl. Phys., 104, 104302.
2008 C. N. Liao and C. H. Lee “Suppression of vigorous liquid Sn/Te reactions by Sn-Cu solder alloys”, J. Mat. Res., 23, 3303.
2008 S. D. Li, J. G. Duh and C. N. Liao “High-frequency ferromagnetic inductors covered by as-deposited FeCoAlO films with stress-induced uniaxial anisotropy”, Thin Solid Films, 516, 7748.
2008 K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu “Observation of Atomic Diffusion at Twin-modified Grain Boundaries in Copper”, Science, 321, 1066.
2008 C. N. Liao, K. M. Liou and H. S. Chu “Enhancement of thermoelectric properties of sputtered Bi-Sb-Te thin films by electric current stressing”, Appl. Phys. Lett., 93, 042103.
2007 C. M. Chen, C. C. Huang, C. N. Liao, and K. M. Liou “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, J. Electron. Mat. 36, 760.
2007 C. M. Tai and C. N. Liao ”A Physical Model of Solenoid Inductors on Silicon Substrates”, IEEE Trans. Microwave Theory Tech., 55(12), 2579.
2007 K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen “Direct observation of electromigration-induced surface atomic steps in Cu lines by in-situ transmission electron microscopy”, Appl. Phys. Lett., 90, 203101.
2007 C. N. Liao, C. H. Lee and W. J. Chen “Effect of interfacial compound formation on contact resistivity of soldered junctions between bismuth telluride based thermoelements and copper”, Electrochem. Solid-State Lett., 10(9), P23.
2007 C. N. Liao and T. H. She Preparation of bismuth telluride thin films through interfacial reaction, Thin Solid Films, 515, 8059.
2007 C. M. Tai and C. N. Liao Multi-level suspended thin film inductors on silicon wafers, IEEE Trans. Electron. Dev., 54 (6), 1510.
2007 C. N. Liao, T. H. She, P. J. Liao and H. S. Chu Oscillatory transport properties of thermally annealed Bi/Te multilayer thin films, J. Electrochem. Soc. 154 (4), H304.
2006 C. N. Liao, H. N. Wu, P. C. Chen and J. W. Yeh Effect of antimony doping on thermoelectric properties of Zr0.5Ti0.5NiSn multi-element alloys, ANNALES DE CHIMIE - science des matériaux, 31(6), 711.
2006 C. N. Liao and C. T. Wei An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples, Thin Solid Films, 515, 2781.
2005 C. N. Liao, C. P. Chung and W. T. Chen Electromigration induced Pb Segregation in Eutectic Sn-Pb Molten Solder, J. Mat. Res., 20, 3425.
2005 C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen In situ transmission electron microscope observations of electromigration in copper lines at room temperature, Appl. Phys. Lett., 87, 141903.
2005 C. N. Liao and K. C. Chen Effect of interfacial resistance and contact size on current crowding at Ni/poly-Si junctions, Semi. Sci. Tech., 20, 659.
2005 C. N. Liao and S. W. Kuo Thermoelectric characterization of sputter-deposited Bi/Te bilayer thin films, J. Vac. Sci. Tech. A, 23, 559 (SCI)
2005 C. N. Liao and K. M. Liou Electrical properties of Cu/Ta interfaces under electrical current stressing, J. Vac. Sci. Tech. A, 23, 359.
2004 C. N. Liao and C. T. Wei Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment, J. Electron. Mat., 33, 1137.
2003 C. N. Liao and K. C. Chen Current crowding effect on thermal characteristics of Ni/doped-Si contacts”, IEEE Electron Device Letters, 24, 637.
2002 C. N. Liao and K. N. Tu Direct measurement of contact temperature using Seebeck potential, J. Appl. Phys., 92, 635.