近期论文

Wang L,Chen G*, Zhu JB, Sun XH, Mei YH, Chen X, Bending ratcheting behavior of pressurized straight Z2CND18.12N stainless steel pipe under different control modes. Structural Engineering and Mechanics, An International Journal. 2014; In press. (★/◆)
Chen G,Liang HQ, Wang L, Mei YH*, Chen X. Multiaxial ratcheting-fatigue interaction on acrylonitrile-butadiene-styrene terpolymer (ABS). Polymer Engineering and Science. 2014; In press. (★/◆)
Chen G,Zhang ZS, Mei YH*, Li X, Yu DJ, Wang L, Chen X. Applying Viscoplastic Constitutive Models to Predict Ratcheting Behavior of Sintered Nanosilver Lap-Shear Joint. Mechanics of Materials. 2014; 72: 61-71. (★/◆)
Chen G,Yu L, Mei YH*, Li X, Chen X, Lu GQ. Reliability Comparison between SAC305 Joint and Sintered Nanosilver Joint at High Temperatures for Power Electronic Packaging. Journal of Materials Processing Technology. 2014; 214(9): 1900-1908. (★/◆)
Fu SC, Gao H,Chen G*, Gao LL, Chen X.Deterioration of mechanical properties for pre-corroded AZ31 sheet in simulated physiological environment. Materials Science & Engineering A. 2014; 593: 153-162. (★/◆)
Chen G,Yu L, Mei YH*, Li X, Lu GQ, Chen X. Uniaxial Ratcheting Behavior of Sintered Nanosilver Joint for Electronic Packaging. Materials Science & Engineering A. 2014; 591: 121-129. (★/◆)
Mei YH,Cao YJ,Chen G*, Li X, Lu GQ, Chen X. Characterization and Reliability of Sinter Nanosilver Joints by A Rapid Current-Assisted Method for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2013; In Press. (★/◆)
Li X,Chen G*, Wang L, Mei YH, Chen X, Lu GQ. Creep Properties of Low-Temperature Sintered Nano-Silver Lap Shear Joints. Materials Science & Engineering A. 2013; 579: 108-113.(★/◆)
Mei YH,Chen G*, Cao YJ, Li X, Han D, Chen X.Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging. Journal of Electronic Materials, 2013; 42(6): 1209-1218. (★/◆)
Mei YH,Cao YJ,Chen G*, Li X, Lu GQ, Chen X. Rapid Sintering Nanosilver Joint by Pulse-Current for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2013;13(1): 258-265. (★/◆)
Chen G,Zhang ZS, Mei YH*, Li X, Lu GQ, Chen X.Ratcheting Behavior of Sandwiched Assembly Joined by Sintered Nanosilver for Power Electronics Packaging. Microelectronics Reliability. 2013; 53(4): 645-651. (★/◆)
Mei YH,Chen G*, Li X, Lu GQ, Chen X. Evolution of Curvature under Thermal Cycling in Sandwich Assembly Bonded by Sintered Nano-silver Paste, Soldering & Surface Mount Technology. 2013; 25(2): 107-116. (★/◆)
Wen MJ, Li H, Yu DJ,Chen G*, Chen X. Uniaxial ratcheting behavior of Zircaloy-4 tubes at room temperature. Materials & Design. 2013; 46, 426-434.(★/◆)
Li X,Chen G*, Chen X, Lu GQ, Wang L, Mei YH.High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. Microelectronics Reliability. 2013; 53(1): 174-181. (★/◆)
Mei YH, Wang T, Cao X,Chen G*, Lu GQ, Chen X. Transient Thermal Impedance Measurement on Low-Temperature Sintered Nano-silver Joints. Journal of Electronic Materials. 2012; 41 (11) : 3152-3160. (★/◆)
Chen G, Cao YJ, Mei YH*, Han D, Li X, Lu GQ, Chen X. Pressures-Assisted Low-Temperature Sintering of Nanosilver Paste for 5×5 mm2Chip Attachment, IEEE Transactions on Components and Packaging Technologies. 2012; 2 (11): 1759-1767. (★/◆)
Li X,Chen G*, Chen X, Lu GQ, Wang L, Mei YH. Mechanical Property Evaluation of Nano-Silver Paste Sintered Joint Using Lap-Shear Test. Soldering & Surface Mount Technology. 2012; 24:120-6. (★/◆)
Chen G, Sun XH, Nie P, Mei YH*, Lu GQ, Chen X. High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films. Journal of Electronic Materials. 2012; 41:782-90.(★/◆)
Chen G, Han D, Mei YH*, Cao X, Wang T, Chen X, et al. Transient Thermal Performance of IGBT Power Modules attached by Low-Temperature Sintered Nano-Silver., IEEE Transactions on Device and Materials Reliability. 2012; 12(1): 124-32. (★/◆)
Chen G, Shan SC, Chen X*, Yuan H. Ratcheting and fatigue properties of the high-nitrogen steel X13CrMnMoN18-14-3 under cyclic loading. Computational Materials Science. 2009; 46: 572-8.(★/◆)
Chen G, Chen X*, Kim KS, Abdel-Karim M, Sakane M. Strain rate dependent constitutive model of multiaxial ratchetting of 63Sn–37Pb solder. ASME Transaction on Journal of Electronic Packaging. 2007; 129: 278. (★/◆)
Chen G, Chen X*. Fatigue damage coupled constitutive model for 63Sn37Pb solder under proportional and non-proportional loading. Mechanics of materials. 2007; 39:11-23. (★/◆)
Chen G, Chen X*, Niu CD. Uniaxial ratcheting behavior of 63Sn37Pb solder with loading histories and stress rates. Materials Science and Engineering: A. 2006; 421: 238-44. (★/◆)
Chen G, Chen X*. Constitutive and damage model for 63Sn37Pb solder under uniaxial and torsional cyclic loading. International journal of solids and structures. 2006;43:3596-612. (★/◆)
Chen G, Chen X*. Finite element analysis of fleXBGA reliability. Soldering & Surface Mount Technology. 2006; 18(2): 46-53. (★/◆)
Chen G, Luo XM, Chen X*, Zhang WH. The Influence of HAZ on Fatigue Life of 16Mn Steel. Advanced Materials Research. 2008; 44: 323-8. (◆)