[1] C H Ye and J S Chen*, M J Xu, X Wei H Lu, Multi-scale simulation of nanoindentation on cast Inconel 718 and NbC precipitate for mechanical properties prediction, Materials Science and Engineering A, 662(2016) pp 385-394. (SCI, Co- first author)[2] J S Chen*, C Yu, H Lu, Theoretical study on the phase stability, elasticity, hardness and electronic structures of Ni-P compounds, Phase Transitions, (2016) pp.1-12. (SCI)[3] J S Chen*, C Yu, H Lu, Phase stability, magnetism, elastic properties and hardness of binary iron nitrides from first principles, Journal of Alloys and Compounds, 625(2015) pp. 224-230. (SCI)[4] J S Chen*, C H Ye, J M Chen, J J Xu, C Yu, H Lu, Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure, Materials Letters,161 (2015) pp. 201-204. (SCI)[5] J S Chen*, C H Ye, C Yu, H Lu, The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints, Computational Materials Science, 108 (PA) (2015) pp.1-7. (SCI)[6] J S Chen*, M J Xu, Y J Jin, K Y Wang, C Yu, H Lu, Effect of electric field and Sn grain orientation on Cu consumption in Sn/Cu solder joint, Computational Materials Science, 95(2014) pp. 166-171. (SCI)
