个人简历

1998年7月毕业于清华大学材料系，工学博士学位；1999年到2001年在香港科技大学从事博士后研究，主要从事倒装芯片封装技术的开发和研究；2001年至2002年在深圳美龙翔公司从事技术研发工作，主持开发增强型散热焊球阵列封装基板；2002年至今在清华大学微电子学研究所工作。\r
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从事微电子封装技术与材料的研究，目前的主要研究方向为先进封装（倒装芯片、三维封装中的互连、高性能封装基板等）技术、系统级封装与异质集成、电子封装中新材料的应用、封装可靠性与失效分析等，承担过多项国家科技重大专项课题。在相关领域发表多篇高水平研究文章，参与出版译著3本，参与编写了《中国集成电路封测产业链技术创新路线图》；因在三维封装及高密度封装基板领域的研究成果获省部级奖两项。\r
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是IEEE高级会员，现担任中国电子学会电子制造与封装分会理事、国家集成电路封测产业技术创新联盟副秘书长、IEEE-EPS北京分会主席、电子元件与技术会议（IEEE-ECTC）技术委员会成员，担任过多届国际电子封装技术（ICEPT）技术委员会共同主席。\r
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讲授《微电子封装技术》（研究生）、《集成电路封装技术》（本科生）等课程。

研究领域

从事微电子封装技术与材料的研究，目前的主要研究方向为先进封装（倒装芯片、三维封装中的互连、高性能封装基板等）技术、系统级封装与异质集成、电子封装中新材料的应用、封装可靠性与失效分析等""

近期论文

Jian Cai, Junqiang Wang, Qian Wang, Experimental and computational investigation of low temperature Cu–Sn solid-state-diffusion bonding for 3D integration,Microelectronic Engineering, 236 (2021) 111479\r
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Yingxia Liu, Xiuyu Shi, Haoxiang Ren,Jian Cai, Xiuchen Zhao, Chengwen Tan, K.N. Tu,Surface diffusion controlled reaction in small size microbumps,Materials Letters, 284 (2021) 129036\r
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Shengjuan Zhou,Jian Cai, Qian Wang, Xiuyu Shi, Xuesong Zhang, Changming Song, A design and fabrication of transmission line for eSiFO in millimeter-wave applications, Yu Chen,2020 IEEE 70TH Electronic Components and Technology Conference (ECTC), 2020-June,2197-2202\r
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Jun-Peng Fang,Jian Cai, Qian Wang, Zhi-Ting Geng, Low Temperature Au-Au Bonding Using Ag Nanoparticles as Intermediate,2020 IEEE 70TH Electronic Components and Technology Conference (ECTC), 2020-June,729-734\r
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Wang, Jin; Wang, Qian; Hou, Xinnan; Du, Ke; Zhao, Lixin;Cai, Jian, Au-Rich/Sn-Bi interconnection in Chip-on-Module package,2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, 69-75\r
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Liu, Ziyu;Cai, Jian; Wang, Qian; Wang, Zheyao; Liu, Lei; Zou, Guisheng, Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate,JOURNAL OF ALLOYS AND COMPOUNDS, OCT 30, 2018, 575-582\r
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Liu, Ziyu;Cai, Jian; Wang, Qian; Liu, Lei; Zou, Guisheng, Modified pulse laser deposition of Ag nanostructure as intermediate for low temperature Cu-Cu bonding,APPLIED SURFACE SCIENCE, JUL 1, 2018, 16-23\r
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Xue, Xingjun; Zhou, Kun;Cai, Jian; Wang, Qian; Wang, Zheyao, Reactive ion etching of poly (cyclohexene carbonate) in oxygen plasma,MICROELECTRONIC ENGINEERING, MAY 5, 2018, 1-9\r
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Wu, Zijian;Cai, Jian; Wang, Qian; Wang, Junqiang; Wang, Dejun, Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness,JOURNAL OF ELECTRONIC MATERIALS, OCT, 2017, 6111-6118\r
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Cai, Jian; Wang, Qian; Wang, Dejun; Wang, Junqiang; Wu, Zijian, Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding,2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, 1742-1747\r
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Wang, Junqiang; Wang, Qian; Wu, Zijian; Tan, Lin;Cai, Jian; Wang, Dejun, Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu-Sn bonding in 3D integration,APPLIED SURFACE SCIENCE, MAY 1, 2017, 525-530\r
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Wu, Zijian;Cai, Jian; Wang, Qian; Wang, Junqiang, Low temperature Cu-Cu bonding using copper nanoparticles fabricated by high pressure PVD,AIP ADVANCES, MAR, 2017\r
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Wang, Junqiang; Wang, Qian; Wu, Zijian; Wang, Dejun;Cai, Jian, Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration,IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, JAN, 2017, 19-26\r
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Wang, Junqiang; Wang, Qian; Liu, Ziyu; Wu, Zijian;Cai, Jian; Wang, Dejun, Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection,APPLIED SURFACE SCIENCE, OCT 30, 2016, 200-206\r
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Liu, Zi-Yu;Cai, Jian; Wang, Qian; Chen, Yu, Detection and formation mechanism of micro-defects in ultrafine pitch Cu-Cu direct bonding,CHINESE PHYSICS B, JAN, 2016