个人简历

教育经历
2012.09-2016.12，北京科技大学，材料科学与工程专业，工学博士
2010.09-2016.12，北京有色金属研究总院，联合培养博士
2015.03-2016.02，University of Leicester，CSC公派博士
2006.09-2010.07，四川大学，金属材料科学与工程，学士

工作经历
2019.06 - 至 今，南方科技大学 机械与能源工程系，研究助理教授
2017.05-2019.05，南方科技大学 机械与能源工程系，博士后
2017.01-2017.04，南方科技大学 机械与能源工程系，访问学者

研究领域

金属3D打印技术及半固态金属成形理论与技术

近期论文

X.G. Hu, Z.H. Hu, W.Y. Qu, X.W. Li, Z. Li, Y. Zhou, S.P. Midson, Q. Zhu. A novel criterion for assessing the processability of semi-solid alloys: the enthalpy sensitivity of liquid fraction [J]. Materialia, 2019, In press, https://doi.org/10.1016/j.mtla.2019.100422.
J.Z. Gao†, X.G. Hu†, Q. Zhu, D.Q. Li, Y.L. Kang. Cooling Behavior and Microstructure of Semisolid A201 Aluminum Alloy Prepared by the SEED Process [J]. Metals, 2019, 9(9), 922; (†contribute equally)
X.G. Hu, Q. Zhu, H.V. Atkinson, H.X. Lu, F. Zhang, H.B. Dong, Y.L. Kang. A time-dependent power law viscosity model and its application in modelling semi-solid die casting of 319s alloy [J]. Acta Materialia, 2017, 124:410-420.
X.G. Hu, Q. Zhu, S.P. Midson, H.V. Atkinson, H.B. Dong, F. Zhang, Y.L. Kang. Blistering in semi-solid die casting of aluminium alloys and its avoidance [J]. Acta Materialia, 2017, 124:446-455.
X.G. Hu, Q. Zhu, H.X. Lu, F. Zhang, S.P. Midson. Microstructural evolution and thixoformability of semi-solid aluminum 319s alloy during re-melting [J]. Journal of Alloys & Compounds, 2015, 649:204-210.
X.G. Hu, Q. Zhu, H.V. Atkinson, M. Luo, F. Zhang, W.Y. Qu. Application of Multiphase Modelling in Semi-Solid Die Casting: Blister Prediction [J]. Solid State Phenomena, 2016, 256:139-145.
X.G. Hu, F. Zhang, Y.F. He, Q. Zhu. Experimental Study and Numerical Simulation on the Blistering Defect during Thixocasting [J]. Solid State Phenomena, 2014, 217-218:144-150.
X.G. Hu, B.C. Yang, J. Xu, H.J. Wang. Hot Deformation Behavior of A390 Hypereutectic Al-Si Alloy [C] Materials Science Forum. Trans Tech Publications, 2013, 749: 88-95.
Qiang Zhu, Ahmed Rassili, Stephen P. Midson, Xiaogang Hu (Eds.), Semi-Solid of Alloys and Composites XV, Trans. Tech. Publications, 2018