个人简历

殷志富，男，毕业于大连理工大学,毕业于大连理工大学。主要从事微尺度3D打印、电射流直写和微纳流控芯片制造技术开发，2012.05-2012.09至加拿大阿尔伯塔大学（UA）进行项目合作研究，2019.12-2021.06在美国加州理工学院（Caltech）从事博士后研究。先后主持国家自然科学基金、吉林省科技发展计划、吉林省教育厅科研规划以及教育部重点实验室基金等项目，并担任Electrophoresis、Ultrasonics、Sensors & Actuators A. Physical等SCI期刊审稿人。目前在微纳尺度结构打印和流控芯片制造方向已取得显著研究成果，在Lab on a Chip（IF：6.136）、Scientific Reports（IF：5.578）、Biomicrofluidics（IF：3.771）、Nanotechnology（IF：3.867）、Organic Electronics（IF：3.495）、Materials Science in Semiconductor Processing（IF：2.593）、Microfluidics and Nanofluidics（IF：2.384）、Journal of Micromechanics and Microengineering（IF：2.045）等国际重要学术期刊上发表数十篇SCI论文。截止到2019年9月，共申请专利10项，发表学术论文56篇（SCI 44篇，国际会议10篇，国内期刊2篇），其中第一作者和通讯作者SCI论文共31篇。\r
出国访学情况：\r
1. 2012.05-2012.09，University of Alberta，Bioengineering，Visiting research\r
2. 2019.12-2021.06，California Institute of Technology，Medical Engineering, Postdoctor\r
教育经历\r
[1] 2011.9 -- 2016.6\r
大连理工大学 微机电工程 博士研究生毕业 博士学位\r
工作经历\r
[1] 2016.7 -- 2018.4\r
吉林大学 机械科学与工程学院

研究领域

""主要从事微尺度3D打印、电射流直写和微纳流控芯片制造技术开发."""承担科研项目情况：\r
1. 纳米尺度射流输运聚焦机理及电射流打印控制技术研究（51705198），国家自然科学基金-青年科学基金，负责人，2018.01-2020.12\r
2. 纳米尺度电射流聚焦打印机理及关键技术研究（20190103063JH），吉林省科技发展计划，负责人，2019.01-2020.12\r
3. 基于电液动力纳米尺度聚合物喷墨打印系统研究，省教育厅科研规划项目，负责人，2020.01-2021.12\r
4. 基于电射流打印的纳米尺度PVP薄膜制备技术研究（KFKT2019-02），教育部重点实验室基金，负责人，2019.07-2021.07\r
5. 基于电射流纳米打印技术研究（419080600005），吉林大学科研项目，负责人，2017.06-2018.12\r
6. 面向应用型人才培养课程教学改革探索（2019XZC101），吉林大学青年教师教学能力提升项目，负责人，2019 .05-2021.05"

近期论文

2019年\r
1. Xingtian Qu, Jinlai Li, Zhifu Yin*, New Lithography Technique Based on Electrohydrodynamic Printing Platform, Organic Electronics, 2019, 71, 279-283\r
2. Jili Wang, Zhifu Yin*, An extra laser welding technique for bonded PMMA chips to avoid edge dehiscence, Lasers in Engineering, 2019, 43(4-6), 261-272\r
3. Zhifu Yin*, Weihang Wang, Structure-induced method for circular cross-sectional nanochannel fabrication, Journal of Nanoscience and Nanotechnology, 2019, 19(9), 5750-5754\r
4. Xinyan Jiang, Dong F.Wang,Zhifu Yin*, Manufacture of microfluidic chips using a gap-control method based on traditional 3D printing technique, Microsystem Technologies, 2019, 25(3), 1043-1050\r
5. Xue Yang, Xinyan Jiang, Zhifu Yin*, Kai Chen, E Cheng, Helin Zou, Dong F. Wang, An economic and concise method to solve nozzle clogging issue during electro hydrodynamic printing, International Journal of Modern Physics B, 2019, 33(23), 1950260\r
2018年\r
1. Xingtian Qu, Jinlai Li, Zhifu Yin*, A novel bonding method for large scale PMMA micro- and nanofluidic devices, Japanese Journal of Applied Physics, 2018, 57(4), 047001\r
2. Zhifu Yin*, E Cheng, Helin Zou, Fast microfluidic chip fabrication technique by laser erosion and sticky tape assist bonding technique, Journal of Nanoscience and Nanotechnology, 2018, 18(6)4082-4086\r
3. Zhifu Yin*, Helin Zou, Lei Sun, PC nanofluidic chip fabrication technique by hot embossing and thermal bonding, Journal of Nanoscience and Nanotechnology, 2018, 18(4), 2530-2535\r
4. Zhifu Yin*, Helin Zou, A fast and simple bonding method for low cost microfluidic chip fabrication, Journal of Electrical Engineering- Elektrotechnicky Casopis, 2018, 69(1), 72-78\r
5. Xingtian Qu, Jinlai Li, Zhifu Yin*, Residual stress release for SU-8 structures by water assist ultrasonic, Microsystem Technologies, 2018, 24(7), 3141-3147\r
6. Jili Wang, Zhifu Yin*, SU-8 nano-nozzle fabrication for electrohydrodynamic jet printing using UV photolithography, Materials Science in Semiconductor Processing, 2018, 84, 144-150\r
7. Zhifu Yin*, Weihang Wang, A novel bonding method for fabrication of PMMA nanofluidic chip with low deformation of the nano-trenches, Microfluidics and Nanofluidics, 2018, 22(9), 99\r
8. Zhifu Yin*, Rapid prototyping of PET microfluidic chips by laser ablation and water-soaking bonding method, Micro & Nano Letters, 2018, 13(9), 1302-1305\r
2017年\r
1. Zhifu Yin*, Bolin Lu, E Cheng, Helin Zou, Fabrication of bottom fillet nano-mold to increase the mold lifetime, Journal of Nanoscience and Nanotechnology, 2017, 17(12), 8975–8980,\r
2. Zhifu Yin*, E Cheng, Helin Zou, Numerical study on the shrinkage behavior of SU-8 patterns, Microsystem Technologies, 2017, 23(10), 4957-4964\r
3. Zhifu Yin*, Bolin Lu, Helin Zou, A novel SU-8 nanofluidic chip fabrication technique by traditional UV photolithography, Microsystem Technologies, 2017, 23(12), 5613-5619\r
4. Zhifu Yin*, Helin Zou, Multilayer patterning technique for micro- and nanofluidic chip fabrication, Microfluidics and Nanofluidics, 2017, 21(12), 174\r
5. Zhifu Yin, Lei Sun, Helin Zou*, Numerical Analysis on PET Demolding Stage in Thermal Nanoimprinting Lithography, Microsystem Technologies, 2017, 23(4): 899-905\r
2016年\r
1. Zhifu Yin*, Helin Zou, Experimental and numerical study on PDMS collapse for fabrication of micro/nanochannels, Journal of Electrical Engineering- Elektrotechnicky Casopis, 2016, 67(6): 414~420\r
2. Zhifu Yin, Liping Qi, Helin Zou*, A novel 2D silicon nano-mold fabrication technique by inclined-deposition and Ar etching over 4 inch large area, Scientific reports, 2016, 6: 18921~18921\r
3. Zhifu Yin, Liping Qi, Helin Zou*, Lei Sun, Shenbo Xu, Low auto-fluorescence fabrication methods for plastic nanoslits, IET nanobiotechnology, 2016, 10(2): 75~80\r
4. Zhifu Yin, Lei Sun, Helin Zou*, Shenbo Xu, Bonding of 1D PMMA nanofluidic chip with low dimension loss and high bonding strength, Journal of Nanoscience and Nanotechnology, 2016, 16(8): 8439-8444\r
5. Zhifu Yin, Lei Sun, Helin Zou*, An innovative low-cost photomask fabrication technique, Journal of Nanoscience and Nanotechnology, 2016, 16(9): 9751-9755\r
6. Zhifu Yin, Lei Sun, Helin Zou*, Shenbo Xu, Optimization of the profile of the nano-mold and the imprinting conditions by numerical simulation method, Microsystem Technologies, 2016, 22(5): 1105~1113\r
7. Zhifu Yin, Lei Sun, E Cheng, Helin Zou*, Numerical study on the de-molding behavior of 2D PMMA nanochannles during hot embossing process, Microsystem Technologies, 2016, 22(1): 129~135\r
2015年\r
1. Zhifu Yin, Lei Sun, Helin Zou*, E Cheng, Two dimensional PMMA nanofluidic device fabricated by hot embossing and oxygen plasma assisted thermal bonding methods, Nanotechnology, 2015, 26(21): 215302~215302\r
2. Zhifu Yin, Liping Qi, Helin Zou*, Lei Sun, Shenbo Xu, A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss and high bonding strength, Journal of Micromechanics and Microengineering, 2015, 25: 085015~085015\r
2014年\r
1. Zhifu Yin, E Cheng, Helin Zou*, Analysis of polymer viscoelastic properties based on compressive creep tests during hot embossing for two-dimensional polyethylene terephthalate nanochannels, Polymer Engineering & Science, 2014, 54(10): 2398~2406\r
2. Zhifu Yin, E Cheng, Helin Zou*, Li Chen, Fabrication of two dimensional PET nanofluidic chip using hot embossing and thermal bonding technique, Biomicrofluidics, 2014, 8(6): 066503~066503\r
3. Zhifu Yin, E Cheng, Helin Zou*, A novel hybrid patterning technique for micro and nanochannel fabrication by integrating hot embossing and inverse UV photolithography, Lab on a Chip, 2014, 14(9): 1614~1621
担任SCI期刊审稿人情况：1. Electrophoresis2. Ultrasonics3. Sensors & Actuators A. Physical4. Journal of Micromechanics and Microengineering5. Journal of Applied Polymer Science6. Journal of Chemical Technology & Biotechnology7. International Journal of Modern Physics B8. Lasers in engineering9. Microsystem technologies10. Recent Patents on Nanotechnology