热点话题人物,欢迎提交收录!
最优雅的名人百科,欢迎向我们提交收录。
张际亮
2023-05-11 02:52
  • 张际亮
  • 张际亮 - 博士 硕士生导师-华侨大学-机电及自动化学院-个人资料

近期热点

资料介绍

个人简历


工作学习经历
1999-2008浙江大学材料系 获学士学位、博士学位
2008-2011 厦门宏发电声股份有限公司博士后工作站
2011-至今 华侨大学机电学院

主持项目:
福建省自然科学基金-青年人才创新项目《铜合金粉末分层(分段)微波烧结的界面结合机理研究》(2012J05093)
高等学校博士学科点专项科研基金《基体表面特性对分段微波烧结制备铜合金界面结合性能的影响研究》(20133501120001)
主要任职
硕士生导师,学院工会委员

研究领域


表面/界面工艺
多孔模具材料"表面/界面工艺:
分层微波烧结快速成形;CVD;表面热处理;表面/界面工程;薄膜、涂层工艺
多孔模具材料:
多孔模具材料的设计与快速成形工艺研究;多孔模具在注塑行业的应用"

近期论文


1. Ji-Liang Zhang, Wei-mu Xu, Zhuan-ke Chen, Jiang-ping Tu.Study on the Electrical Life of AgSnO2 Contacts in Automotive Inductive Load Applications. ICREPEC 3rd Proceedings 2009
2. ZHANG Ji-Liang, LI Jian, LUO Lai-ma, WO Yin-hua.Microstructure and morphology of SiOx film deposited by APCVD. Journal of Alloy and Compound. 2009, 469(12):535-538 (SCI, EI)
3. Zhang Ji-Liang, Li Jian. A Simple Approch of Preparing Amorphous SiOx Film on Aluminum Substrate. Materials Letters. 2007, 61(29):5110-5112 (SCI, EI)
4. ZHANG Ji-liang, SUN Xue-peng, LI Jian, WO Yin-hua.Mechanical properties of SiOx film on aluminum substrate. Transactions of materials and heat treatment. 2007, 28(Supplement):275 -278. (EI)
5. Zhang Ji-Liang, Li Jian, Wo Yin-Hua, Wang You-Wen, Gan Zheng-Hao. Bending test and bonding mechanism analysis of the SiOx film on aluminum substrate. Transactions of materials and heat treatment. 2006, 27(1):68-70. (EI)
6. Zhang Ji-Liang, Wo Yin-Hua, Li Jian; Gan Zheng-Hao, Xu Ya-Bo. Optical properties of SiOx film on aluminum substrate prepared by APCVD. Journal of Zhejiang University (Engineering Science). 2005, 39(8):1243-1246. (EI)
7. ZHANG Ji-liang, LI Jian, WO Yin-hua, WANG You-wen, GAN Zheng-hao. Analysis of the SiOx Film Microstructure on Al Substrate by APCVD Process. 14th Congress of International Federation for Heat Treatment and Surface Engineering. Transactions of materials and heat treatment. 2004, 25(5):847-850. (EI)
8. Zhang Ji-Liang, Li Jian, Wo Yin-Hua, Wang You-Wen, Shen Fu-Chu, Gan Zheng-Hao. Microstructure and Properties of SiOx Film on Aluminum Substrate by CVD Process. Chinese Journal of Nonferrous Metals. 2004, 14(6):961-966(EI)

相关热点

扫码添加好友