个人简历

工作学习经历：
1999.9-2003.7 燕山大学材料学院无机非金属材料系超硬材料专业，获学士学位
2003.9-2009.5 亚稳材料制备技术与科学国家重点实验室（燕山大学）材料学专业，获博士学位
2009.08-2013.12 华侨大学机电及自动化学院 讲师
2014.01-2017.12 华侨大学制造工程研究院 副教授
2014.12-2015.12美国德州大学达拉斯分校 访问学者
2017.12 至今 华侨大学制造工程研究院 教授
主持或参与的科研项目：
1.国家自然科学基金青年项目，面向单晶SiC基片的单分散纳米金刚石半固结超精密加工技术研究，2012.01-2014.12，26万，主持。
2.国家自然科学基金面上项目，硬核软壳纳米复合磨粒的半固结柔性加工技术基础研究，2015.01-2018.12，80万，主持。
3.福建省科技计划项目，基于损伤检测的蓝宝石晶圆抛光技术研究，2018.04-2021.03，主持。
4.厦门市科技计划项目，单晶碳化硅晶圆高效超精抛光技术研究，2017.03-2020.03，20万，主持。
5.福建省高等学校新世纪优秀人才支持计划，金刚石晶圆的混合磨料半固结柔性抛光技术基础研究，2018.06-2020.07，6万，主持。
6.国家自然科学基金重点项目，晶圆级单晶金刚石衬底的活性/硬质磨粒协同加工原理与关键技术研究，2018.01-2022.12，300万，参与。
主要学术成果：
在国内外高水平刊物发表SCI收录学术论文82篇，申报专利26项、美日韩国际专利各2项，授权发明专利6项、实用新型专利4项、PCT1项、美国专利1项。2018年获福建省自然科学优秀学术论文一等奖。受聘晶安光电技术顾问，芯光润泽外聘专家，宽禁带半导体材料制备山西省重点实验室外聘专家。2018年获福建省教学成果奖一等奖，2018年获全国“互联网+”大学生创新创业大赛铜奖和福建省“互联网+”大学生创新创业大赛优秀指导老师。

研究领域

半导体晶圆衬底超精密加工
智能制造新型磨抛工具的研发"纳米材料的表面修饰改性及应用
超精密磨抛工具中结合剂与磨料的界面结合"

近期论文

1. Jianbing Zang, Jing Lu, Xuehai Qi, Yanhui Wang*. Characterization of silicon films grown by atomic layer deposition on nanocrystalline diamond. Diamond and related materials, 2006, 15(9): 1434-1437. (SCI, WOS: 000240047300039, IF:2.561)
2. Jing Lu, Yanhui Wang, Jianbing Zang*, Y.N. Li. Protective silicon coating for nanodiamonds using atomic layer deposition. Applied surface science, 2007, 253(7): 3485-3488.(SCI, WOS:000244381700022, IF=3.387)
3. Jing Lu, JianBing Zang, Shan S X, H. Huan, Yanhui Wang*. Synthesis and characterization of core− shell structural MWNT− zirconia nanocomposites. Nano letters, 2008, 8(11): 4070-4074.(SCI, WOS: 000260888600092, IF=12.712)
4. Jianbing Zang, Jing Lu, Yanghui Wang, Jinhui Zhang, X.Z. Cheng, H. Huang. Fabrication of core–shell structured MWCNT–Ti(TiC) using a one-pot reaction from a mixture of TiCl3, TiH2, and MWCNTs. Carbon, 2010, 48(13): 3802-3806. (SCI, WOS: 000281190800018, IF= 6.337)
5. 陆静, 罗求发, 宋运运, 胡光球，徐西鹏. 凝胶结合剂超细金刚石磨粒工具的制备及应用. 机械工程学报, 2015, 51(15)：205-212. （EI，Accession number: 20153701258946）
6. Jing Lu, Yang Li, Xipeng Xu*. The effects of abrasive yielding on the polishing of SiC wafers using asemi-fixed flexible pad. Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture, 2015, Vol. 229(S1) 170-177. (SCI, WOS: 000352579400013, IF=1.366)
7. Yang Li, Jing Lu*, and Xipeng Xu. Phase transformation of monocrystalline silicon induced by polishing with diamond abrasives. IEEE Transactions on Semiconductor Manufacturing, 2015, 28(2): 153-159. (SCI, WOS: 00035418940000, IF=1.117)
8. Jing Lu*, Jianbing Zang, Yanhui Wang, Yongchao Xu, Xipeng Xu. Preparation and characterization of zirconia-coated nanodiamonds as a Pt catalyst support for methanol electro-oxidation. Nanomaterials, 2016, 6: 234. (SCI, WOS: 000392240000013, IF=3.553）
9. Qiufa Luo, Jing Lu*, Xipeng Xu. A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools. Wear, 2016, 350-351: 99-106. (SCI, WOS: 000370535900013, IF=2.531)
10. Yongchao Xu, Jing Lu*, Xipeng Xu. Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing. Applied Surface Science, 2016, 389: 713-720. (SCI, WOS: 000384577600087, IF=3.387）
11. Qiufa Luo, Jing Lu*, Xipeng Xu. Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools. Tribology International, 2016, 104: 191-203. (SCI, WOS: 000386186500019, IF=2.903)
12. Jing Lu*, Qiufa Luo, Xianyan Mao, Xipeng Xu, Yanhui Wang, Hua Guo. Fabrication of a resin-bonded ultra-fine diamond abrasive polishing tool by electrophoretic co-deposition for SiC processing. Precision Engineering, 2017, 47: 353-361. (SCI, WOS: 000389090200035, IF=2.237)
13. Jing Lu*, Yaguang Wang, Qiufa Luo, Xipeng Xu. Photocatalysis assisting the mechanical polishing of a single-crystal SiC wafer utilizing an anatase TiO2-coated diamond abrasive. Precision Engineering, 2017, 49: 235-242. (SCI, WOS: 000402444000024, IF=2.237 )
14. Jing Lu*, Yongchao Xu, Yunhe Zhang, Xipeng Xu. The effects of SiO2 coating on diamond abrasives in sol-gel tool for SiC substrate polishing. Diamond and Related Materials, 2017, 76: 123-131. (SCI, WOS: 000403858500019, IF=2.561）(51475175, 20133501130001, ZQN-YX202).
15. Jing Lu*, Yongchao Xu, Dayu Zhang, Xipeng Xu. The synthesis of the core/shell structured diamond/akageneite hybrid particles with enhanced polishing performance. Materials, 2017, 10: 673. (SCI, WOS: 000404415000107, IF=2.654）
16. Qiufa Luo, Jing Lu*, Xipeng Xu, Feng Jiang. Removal mechanism of sapphire substrates (0001, 11-20 and 10-10) in mechanical planarization machining. Ceramics International, 2017, 43: 16178-16184. (SCI, WOS:000414106600020，IF=2.986 )
17. Jing Lu, Qiufa Luo, Xipeng Xu, Hui Huang, Feng Jiang. Removal mechanism of 4H- and 6H-SiC substrates (0001 and 000-1) in mechanical planarization machining. Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture, 2019, 233(1) 69-76.