个人简历

1980年7月出生于黑龙江省宾县。1999年考入哈尔滨工业大学焊接系，2003年以专业第一名成绩保送攻读硕士研究生，2005年推荐攻读博士研究生，于2008年8月30日获得工学博士学位。长期从事功率超声在微纳连接、电子封装等领域的基础和应用基础研究，致力于超声与材料表界面的组织-结构-性能相互作用规律的探求、以及超声技术推广应用。近来，同时研究纳米颗粒、纳米线等用于柔性印刷电子及可穿戴领域。相关研究结果在Scripta Materialia、Ultrasonics Sonochemistry等国际高水平专业期刊上发表SCI论文50余篇、国际会议报告论文40余篇；参编译著一部；授权中国专利10余项。主持国家自然科学基金面上、青年基金、广东省自然科学基金等4项；主持国防“双百工艺”、“两机”重大专项（合作单位负责人）等国家省部级纵向项目10余项。2008年获哈尔滨工业大学优秀博士毕业生；2008年获ICEPT国际会议IEEE-CPMT最佳论文奖；2011年入选首批深圳市海外高层次人才，2015年入选深圳市高层次人才，2015 EAST-Welding国际会议分会场主席，2016年度哈尔滨工业大学第五届青年教师研究生课程教学竞赛二等奖、2017年哈尔滨工业大学（深圳）优秀共产党员，中国机器人焊接联盟-2018中国焊接机器人发展论坛邀请报告，中国机械工程学会IFWT2018焊接国际论坛邀请报告，2019IEEE NANO邀请报告，在电子封装顶级国际会议ECTC、ICEPT以及TMS、MS&T、EAST-WJ等国际会议上做口头报告近40场。2019年入选哈尔滨工业大学（深圳）首届教学先进个人。
招生计划：
1. 硕士研究生2-3名，推免生优先；有继续读博兴趣的同学优先；
2. 博士生1-2名（招生专业为材料加工工程，材料科学与工程学科），提供多渠道的国外交流访问和企业实践机会；
3. 博士后1-2名，常年招收，待遇从优，可面谈。
欢迎积极进取、踏实勤奋的青年才俊加入课题组。
教育经历
2005.08-2008.08 哈尔滨工业大学，获工学博士学位（材料加工工程，微纳连接、电子封装方向）
2003.08-2005.07 哈尔滨工业大学，获工学硕士学位（材料加工工程，微纳连接、电子封装方向）
1999.08-2003.07 哈尔滨工业大学，获工学学士学位（材料成型及控制工程，焊接方向）
研究与工作经历
2021.01-至今 哈尔滨工业大学（深圳），人力资源处处长
2020.01-至今 哈尔滨工业大学（深圳），材料学院，教授，博士生导师
2018.06-2020.12 哈尔滨工业大学（深圳），材料学院，党委书记
2017.04-2019.12 哈尔滨工业大学（深圳），材料学院，副教授，博士生导师
2012.08-2019.12 哈尔滨工业大学深圳研究生院，材料学院，副教授
2010.03 日本国立材料科学研究所，访问学者
2009.11-2012.07 哈尔滨工业大学深圳研究生院，材料学院，助理教授
2008-2009 日本国立材料科学研究所，NIMS博士后研究员
科研项目
2018-2021 国家自然科学基金面上项目，超声激励氧化铝钎缝原位自生陶瓷相的耐高温接头形成机理研究
2018-2020 广东省自然科学基金自由申请，面向汽车电子的热界面Sn基复合钎料互连原理和性能
2015-2017 广东省自然科学基金自由申请，功率器件封装用陶瓷基板与热沉直接连接新原理
2011-2013 国家自然科学基金青年基金，超声诱发粗晶纯铝细丝塑性孪晶变形机理的透射电镜研究
2019-2020 军委装备发展部一般领域基金
2019-2021 国防科工局基础科研”双百工艺“
2012-2014 教育部留学归国人员启动基金，超声作用下微细纯铝丝塑性变形机制研究
2011-2013 深圳市重点实验室提升项目，超声波在新材料/特种材料连接中的共性技术及应用研究
2011-2014 深圳市孔雀计划研发项目，块体非晶及纳米材料的超声波连接关键技术及应用研究
2019-2021 深圳市科创委基础研究学科布局
科研成果及奖励
2015 深圳市高层次专业人才
发明专利
17.一种透明柔性多功能传感器及其制备方法，发明人：计红军，尹凡奇，刘昊，黄嘉一，赵维巍，马星，张嘉恒，冯欢欢，李明雨，申请号：201810577559.9
16.一种用于射频识别RFID天线导电图案的材料，发明人：计红军，周均博，李明雨，申请号：201711241749.5
15. 一种氧化石墨烯自组装复合银纳米线改善柔性器件机械性能的方法，发明人：计红军，陆骅俊，赵维巍，李明雨，授权号：201710950176.7
14.一种降低纳米金属颗粒烧结温度的方法，发明人：赵维巍，计红军，何鹏，张玲，林铁松，冯欢欢，马星，张嘉恒，李明雨，申请号：201710581612.8
13.一种一体式感应熔炼气雾化制粉装置及气雾化制粉的方法，发明人：计红军，周均博，梁孟，陆骅俊，马舒，申请号：201710358256.3
12. 一种面阵列的封装方法，发明人：马鑫，汪敏，计红军，李明雨，梁孟，黄嘉一，申请号：201710472517.4，授权日期：2019-11-08
11. 用于面阵列封装用铜基非晶焊球及其制备方法及封装方法，发明人：计红军，梁孟，李明雨，马鑫，黄嘉一，申请号：201710442433.6，授权日期：2019-11-12
10.一种金属纳米线的定向排布方法，发明人：计红军，陆骅俊，梁孟，周均博，马舒，申请号：201710359450.3，授权日期：2019-08-29
9. 一种互连钎料及其互连成形方法，发明人：计红军，李明刚，申请号：201610847725.3，授权日期：2018-10-26
8. 一种快速生成高熔点接头的芯片键合方法及超声压头设计,发明人：计红军，乔云飞，申请号：201510288396.9，授权日期：2018-03-13
7. 一种大气环境下快速原位生成同质相氧化铝陶瓷的连接方法，发明人：计红军，李明雨，程晓，申请号：201310071412.X，授权日期：2016-01-13
6. 大气环境下硬质材料实现可控间隙连接的方法和该方法使用的模具，发明人：计红军，李明雨，程晓，申请号：201310071404.5，授权日期：2015-11-18.
5. 一种芯片贴装用纳米银浆及其制备方法，发明人：李明雨，王帅，计红军，申请号：201210426581.6，授权日期：2014-08-06.
4. 一种高性能锡基钎料合金及其制备方法，发明人：李明雨，肖勇，计红军，申请号：201110437617.6，授权日期：2014-05-07.
3. 异质金属材料间的钎焊方法，发明人：李明雨，计红军，肖勇，申请号：201110066369.9，授权日期：2013-04-10.
2. 精密部件的电阻热与超声振动复合加热钎焊方法，发明人：王玲，李明雨，王帅，计红军，等，申请号：201010148954.9，授权日期：2012-02-08.
1. 一种面阵封装电子元件的室温超声波软钎焊方法，发明人：李明雨，王晓林，计红军，申请号：200810168269.5，授权日期：2011-12-28
任教和任导师经历
授课：
本科生课程：主讲《材料表面与界面》、《材料科学与工程专业综合实验》电子材料方向实验；
硕士生课程：主讲课程《电子封装互连方法》、《先进材料表征技术》TEM部分的讲授。
在读博士生：
2020年春入学：
1.周昌杰，男，本、硕为苏州大学，喷墨打印工艺及器件，在读；
2.朱立华，男，硕士湖南大学，高温合金，在读；
2019年入学：
1.马秋晨，男，本科福州大学，超声致塑性行为及界面冶金机制，硕士东北大学，在读;
2.潘 浩，男，本科武汉理工大学，严重非平衡条件下的润湿机制，硕士本校，在读;
2018秋入学：
1.张 琳，女，本科合肥工业大学，硕士本校，纳米线及器件，在读；
2.张文武，男，本科华北科技学院，硕士广东工业大学，复合颗粒浆料，在读；
在读硕士生：
2019级：
1.丁家慧，女，本科武汉理工，在读；
2.陈 闯，男，本科太原理工大学，在读；
3.胡兆成，男，本科西北工业大学，在读；
在读本科生：
1、李诺梅，女，纳米器件
2、徐诗韵，男，光子烧结
本组毕业生：
本科毕业生：
1.修子进，男，大功率器件芯片贴装散热，留校，辅导员
2.鄂依阳，男，柔性印刷电子纳米浆料，南方科技大学，读硕
硕士毕业生：
2018级：
1.周文博，男，本科哈工大威海，研究方向：超声钎焊，毕业第一去向：中国航发；
2.曹依琛，男，本科哈工大本部，研究方向：超声烧结，毕业第一去向：苏州汇川；
3.赵长垚，男，本科哈工大本部，研究方向：纳米线器件，毕业第一去向：华为；
4.宋 成，男，本科兰州理工，研究方向：超声金属焊接，毕业第一去向：海光信息技术；
2017级：
1. 渔家傲，女，本科哈工大本部，研究方向：纳米线及其器件，中国航天科技集团三院35所；
2. 潘 浩，男，本科武汉理工大学，研究方向：复合颗粒钎料热性能及其功率封装应用，本校读博；
2016级：
1. 刘 昊，女，本科哈工大本部，研究方向：纳米颗粒及其印刷性能，毕业第一去向：华为；
2. 黄嘉一，男，本科华南理工大学，研究方向：功率器件芯片封装UTLP，毕业第一去向：华为；
3. 尹凡奇，男，本科哈工大校本部，研究方向：纳米线及其传感器制备，毕业第一去向：华为；
2015级：
1. 梁 孟，男，本科哈工大校本部，研究方向：气雾化法制备微米金属颗粒（化合物、非晶），毕业第一去向：西门子(深圳)磁共振有限公司；
2. 马 舒，男，本科三峡大学，研究方向：SnBi钎料复合钎料，毕业第一去向：深圳市高新投集团；
3. 陆骅俊，男，本科哈工大校本部，研究方向：纳米线及柔性传感器，毕业第一去向：华星光电；
4. 周均博，男，本科燕山大学，研究方向：纳米颗粒及其在功率、印刷器件上的应用，毕业第一去向：华为；
2014级：
1. 裴 帅，女，本科哈工大校本部，研究方向：纳米线及可穿戴柔性传感器，毕业第一去向：华为；
2. 吕潇雅，女，本科哈工大威海，研究方向：纳米Cu@Ag及其印刷电子电路，毕业第一去向：南京55所；
3. 张长安，男，本科哈工大校本部，研究方向：陶瓷-金属超声钎焊，毕业第一去向：华为；
4. 李明刚，男，本科河北科技大学，研究方向：功率器件芯片键合封装，毕业第一去向：国微电子；
5. 曹恒振，男，本科哈工大威海，研究方向：纳米Cu6Sn5及其在锂电负极中应用，毕业第一去向：沙钢投资；
2013级：
1. 王 娇，女，本科哈工大威海，研究方向：金凸点-Sn基钎料复合Flip Chip焊点电迁移，毕业第一去向：华为；
2. 王 哲，男，本科哈工大校本部，研究方向：纳米Cu@Sn及其在功率、印刷器件上的应用，毕业第一去向：汇顶科技；
3. 乔云飞，男，本科哈工大威海，研究方向：功率器件芯片键合封装，毕业第一去向：华为；
4. 卢志平，男，本科哈工大威海，研究方向：气雾化制粉平台，毕业第一去向：深信服；
5. 何气敬，男，本科哈工大校本部，研究方向：陶瓷超声钎焊，毕业第一去向：华为；
2012级：
1. 王荔洁，女，本科哈工大校本部，研究方向：非晶润湿性，毕业第一去向：中兴通讯；
2. 陈 昊，男，本科哈工大威海，研究方向：陶瓷-金属超声钎焊，毕业第一去向：校本部读博；
3. 徐 龑，男，本科南京理工大学，研究方向：纳米Cu6Sn5及其功率器件应用，毕业第一去向：校本部读博；
4. 李天亮，男，本科哈工大校本部，研究方向：非晶超声焊接，毕业第一去向：长客；
5. 陈上杭，男，本科哈工大校本部，研究方向：陶瓷超声钎焊，毕业第一去向：武汉铁锚；
2011级：
1. 崔 洋，男，本科哈工大校本部，研究方向：材料表面改性，毕业第一去向：华晨宝马；
2. 李 龙，男，本科重庆大学，研究方向：非晶超声钎焊，毕业第一去向：华为；
3. 程 晓，男，本科湘潭大学，研究方向：陶瓷超声钎焊，毕业第一去向：xx；
4. 李延林，男，本科吉林大学，研究方向：UAM/UC及超声金属塑性机制，毕业第一去向：长客；
5. 陆思源，男，本科哈工大校本部，研究方向：Sn基复合钎料，毕业第一去向：南南铝业；
2010级：
1. 翟明智，男，本科哈工大威海，研究方向：7系铝合金弧焊，毕业第一去向：南京55所；
2. 马昱友，男，本科哈工大威海，研究方向：磁头激光软钎焊，毕业第一去向：大连华锐；
3. 王君兆，男，本科燕山大学，研究方向：超声金属塑性机制，毕业第一去向：美信检测；
4. 麦成乐，男，本科哈工大校本部，研究方向：太阳能电池玻璃料，毕业第一去向：继续读博；

研究领域

1. 超声加工原理与技术（超声辅助材料制备合成，超声诱发塑性变形，超声无损检测技术等）
2. 表面、界面的微观结构与性能（电子显微分析，包括SEM,TEM等）
3. 新材料连接技术（高性能材料及特种材料，如硬质合金，陶瓷，高强合金，非晶纳米晶等）
4. 先进电子封装互连材料与技术（引线键合，芯片键合等）
5. 可穿戴、柔性传感器（纳米金属颗粒、纳米金属线及其核壳结构的合成、印刷、器件）""

近期论文

参编译著：
1. 《微连接与纳米连接》，机械工业出版社，2010
发表代表性论文：
ResearcherID: K-1107-2013
ORCID：http://orcid.org/0000-0002-4159-6838
55. Wenwu, Zhang, Yichen Cao, Jiayi Huang, Weiwei Zhao, Xiangli, Liu, Mingyu Li，Hongjun Ji. Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: principle, kinetics, microstructure, and joint properties. Ultrasonics Sonochemistry, 2020, 66:105090. (JCR Q1，Impact factor:7.279)
https://doi.org/10.1016/j.ultsonch.2020.105090
54. Gu, Jiahui; Hu, Shaowei; Ji, Hongjun, etc. Multi-layer silver nanowire/polyethylene terephthalate mesh structure for highly efficient transparent electromagnetic interference shielding. Nanotechnology, 2020, 31(18): 185303.
https://doi.org/10.1088/1361-6528/ab6d9d
53. Huang, C., et al., Ultrafast control of vortex microlasers. Science, 2020. 367(6481): 1018-1021.
https://doi.org/10.1126/science.aba4597
52. Huaqiang Fu, Yong Xiao, Rongguo Song, Zhe Wang, Hongjun Ji, etc. Rapid soldering of flexible graphene assembled films at low temperature in air with ultrasonic assistance, Carbon, 2020, 158: 55-62.
https://doi.org/10.1016/j.carbon.2019.11.089
51. Zhang, Changan, Ji, Hongjun, etc. Interfacial microstructure and mechanical properties of ultrasonic-assisted brazing joints between Ti–6Al–4V and ZrO2. Ceramics International, 2020, 46(6): 7733-7740.
https://doi.org/10.1016/j.ceramint.2019.11.276
50. Jiaao Yu, Lin Zhang, Hongjun Ji. Preparation of Nanometer Cu6Sn5 and Its Application in Lithium-Ion Batteries Anode for Mass Production. General Chemistry. 2020, 6 (1): 180028-180028. (Cover)
http://dx.doi.org/10.21127/yaoyigc20180028
49. Yin F, Lu H, Pan H, Ji H*, et al. Highly sensitive and transparent strain sensors with an ordered Array structure of AgNWs for Wearable Motion and Health Monitoring. Scientific reports, 2019, 9(1): 2403. (JCR Q1, Impact factor: 4.122)
http://dx.doi.org/10.1038/s41598-019-38931-x
48. Yang, H., et al., Nucleation behavior of Mg2Sn on Ta surface during ultrasonic-assisted soldering of Ta/Sn/Mg joint. Journal of Materials Science: Materials in Electronics, 2019. 30(18SI): 17239-17244.
https://doi.org/10.1007/s10854-019-02071-9
47. Yang H, Tan Q, Ji H*, et al. Dissolution and nucleation behavior of Al in Ta/Sn/Al joints during ultrasonic-assisted soldering. Materials Letters, 2019, 252(1): 103-105. (JCR Q2, Impact factor: 2.687)
https://doi.org/10.1016/j.matlet.2019.05.103
46. Pan H, Ji H*, Liang M, et al. Size-Dependent Phase Transformation during Gas Atomization Process of Cu–Sn Alloy Powders. Materials, 2019, 12(2): 2452. (JCR Q2, Impact factor: 2.467)
https://doi.org/10.3390/ma12020245
45. Jiang, K., et al., An invisible private 2D barcode design and implementation with tunable fluorescent nanoparticles. RSC Advances, 2019. 9(64): 37292-37299.
https://doi.org/10.1039/c9ra05774a
44. Feng H, Zheng T, Li M, Ji H, et al. Droplet‐based Microfluidics Systems in Biomedical Applications. Electrophoresis, 2019, 40(11): 1580-1590. (JCR Q2, Impact factor: 2.569)
https://doi.org/10.1002/elps.201900047
43. Feng P, Ji H, Zhang L, et al. Highly Stretchable Patternable Conductive Circuits and Wearable Strain Sensors based on Polydimethylsiloxane and Silver Nanoparticles. Nanotechnology, 2019, 30. (JCR Q2, Impact factor: 3.404)
https://doi.org/10.1088/1361-6528/ab013b
42. Hu B, Yang F, Peng Y, Ji H, et al. Rapid formation of Cu–Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste. Journal of Materials Science: Materials in Electronics, 2019, 30(8): 8071-8079. (JCR Q2, Impact factor: 2.324)
http://dx.doi.org/10.1007/s10854-019-01129-y
41. Hu S, Gu J, Zhao W, Ji H, et al. Silver‐Nanowire Mesh‐Structured Transparent Conductive Film with Improved Transparent Conductive Properties and Mechanical Performance. Advanced Materials Technologies, 2019, 4: 1900194. (JCR Q1, Impact factor: 4.622)
https://doi.org/10.1002/admt.201900194
40. Du, Y., et al., Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding. Journal of Materials Science-Materials in Electronics, 2019. 30(14): 12840-12850.
https://doi.org/10.1007/s10854-019-01729-8
39. Li, Y., et al., Self-assembly of nickel: from nanoparticles to foils with tunable magnetic properties. Crystengcomm, 2019. 21(35): 5317-5321.
https://doi.org/10.1039/c9ce00940j
38. Li Y, Wang Q, Wang Y, Ji H, et al. A flexible and conductive metallic paper-based current collector with energy storage capability in supercapacitor electrodes. Dalton Transactions, 2019, 48(22): 7659-7665. (JCR Q1, Impact factor: 3.930)
https://doi.org/10.1039/C9DT01066A
37. Pan H, Huang J, Ji H*, et al. Enhancing the solid/liquid interfacial metallurgical reaction of Sn+ Cu composite solder by ultrasonic-assisted chip attachment. Journal of Alloys and Compounds, 2019, 784: 603-610. (JCR Q1, Impact factor: 3.779)
https://doi.org/10.1016/j.jallcom.2019.01.090
36. Hongjun Ji, Junbo Zhou,Meng Liang, Huajun Lu,Mingyu Li,Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging, Ultrasonics Sonochemistry, 2018, 41: 375-381.(JCR Q1，Impact factor:6.012)
https://doi.org/10.1016/j.ultsonch.2017.10.003
35. Hongjun Ji, Hao Chen, Mingyu Li, Overwhelming reaction enhanced by ultrasonics during brazing of alumina to copper in air by Zn-14Al hypereutectic filler, Ultrasonics Sonochemistry, 2017, 35: 61-71.(JCR Q1，Impact factor:6.012)
https://doi.org/10.1016/j.ultsonch.2016.09.003
34. Zhongyang Liu,Hongjun Ji,Shuai Wang,Weiwei Zhao,Yan Huang,Huanhuan Feng,Jun Wei,Mingyu Li,Enhanced Electrical and Mechanical Properties of a Printed Bimodal Silver Nanoparticle Ink for Flexible Electronics,Physica status solidi a-applications and materials science, 2018, 215:1800007.(JCR Q3，Impact factor:1.795)
https://doi.org/10.1002/pssa.201800007
33. Jiahui Gu, Xuelin Wang, Hongtao Chen, Shihua Yang, Huanhuan Feng, Xing Ma, Hongjun Ji, Jun Wei,Mingyu Li,Conductivity enhancement of silver nanowire networks via simple electrolyte solution treatment and solvent washing, Nanotechnology, 2018, 29:265703.(JCR Q2，Impact factor:3.404)
https://doi.org/10.1088/1361-6528/aabbbc
32. Yahong Du,Zhi-Quan Liu,Hongjun Ji,Mingyu Li,Ming Wen,The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding,Journal of Materials Science: Materials in Electronics, 2018, 29: 13774-13781.(JCR Q3，Impact factor:2.324)
https://doi.org/10.1007/s10854-018-9508-z
31. Hongjun Ji, Hao Chen, Mingyu Li, Effect of ultrasonic transmission rate on microstructure and properties of the ultrasonic-assisted brazing of Cu to alumina, Ultrasonics Sonochemistry, 2017, 34: 491-495.(JCR Q1，Impact factor:6.012)
http://dx.doi.org/10.1016/j.ultsonch.2016.06.031
30. C. Zhang, S. Pei, H. Ji*, Y. Cui and M. Li, Fabrication of Ni60–SiC coating on carbon steel for improving friction, corrosion properties, Materials Science and Technology, 2017, 33: 446-453.(JCR Q2，Impact factor:1.803)
http://dx.doi.org/10.1080/02670836.2016.1224216
29. Hongjun Ji, Jiao Wang, Mingyu Li, Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging, Microelectronics Reliability, 2016, 66: 134-142.(JCR Q3，Impact factor:1.236)
http://dx.doi.org/10.1016/j.microrel.2016.10.003
28. Jingdong Liu,Hongtao Chen, Hongjun Ji, Mingyu Li, Highly Conductive Cu?Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles, ACS Applied Materials and Interfaces, 2016, 8: 33289-33298.(JCR Q1，Impact factor:8.097)
http://pubs.acs.org/doi/10.1021/acsami.6b10280
27. Jingdong Liu, Hongjun Ji, Shuai Wang, Mingyu Li, The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink, Journal of Materials Science: Materials in Electronics, 2016, 27: 13280-13287.(JCR Q3，Impact factor:2.324)
https://link.springer.com/content/pdf/10.1007%2Fs10854-016-5476-3.pdf
26. Hongjun Ji, Xiao Cheng, Mingyu Li, Ultrafast ultrasonic-assisted joining of bare α-alumina ceramics through reaction wetting by aluminum filler in air, Journal of the European Ceramic Society, 2016, 36: 4339-4344. (JCR Q1，Impact factor:3.794)
http://dx.doi.org/10.1016/j.jeurceramsoc.2016.06.028
25. Hongjun Ji, Minggang Li, Shu Ma, Mingyu Li, Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging. Materials and Design, 2016, 108: 590-596.(JCR Q1，Impact factor:4.525)
http://dx.doi.org/10.1016/j.matdes.2016.07.027
24. Ming Yang, Hongjun Ji, Shuai Wang, Yong-Ho Ko, Chang-Woo Lee, Jianxin Wu, Mingyu Li, Effects of Ag content on the interfacial reactions between liquid Sn-Ag-Cu solders and Cu substrates during soldering, Journal of Alloys and Compounds, 2016, 679: 18-25.(JCR Q1，Impact factor:3.779)
http://dx.doi.org/10.1016/j.jallcom.2016.03.177
23. Ming Yang, Shihua Yang, Hongjun Ji, Yong-Ho Ko, Chang-Woo Lee, Jianxin Wu, Mingyu Li, Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method, Journal of Materials Processing Technology 2016, 236: 84-92.(JCR Q1，Impact factor:3.647)
http://dx.doi.org/doi:10.1016/j.jmatprotec.2016.04.019
22. Hongjun Ji, Yufei Qiao, Mingyu Li, Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application. Scripta Materialia 2016, 110: 19-23.(JCR Q1，Impact factor:4.163)
http://dx.doi.org/10.1016/j.scriptamat.2015.07.036
21. Hongjun Ji, Qiang Wang, Mingyu Li, Microstructural evolution of lead-free solder joints in ultrasonic-assisted soldering. Journal of Electronic Materials 2016, 45: 88-97.(JCR Q3，Impact factor:1.566)
https://doi.org/10.1007/s11664-015-4108-7
20. Hongjun Ji, Yuyou Ma, Mingyu Li,Chunqing Wang,Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering,Journal of Electronic Materials 2015, 44: 733-743.(JCR Q3，Impact factor:1.566)
http://dx.doi.org/10.1007/s11664-014-3516-4
19. Hongjun Ji, Long Li, Mingyu Li, Low-temperature joining of Fe-based amorphous foil with aluminum by ultrasonic-assisted soldering with Sn-based fillers. Materials and Design 2015, 84: 254-260.(JCR Q1，Impact factor:4.525)
http://dx.doi.org/10.1016/j.matdes.2015.06.112
18. Hongjun Ji, Long Li, Lijie Wang, Mingyu Li, Microstructures and properties of the Fe-based amorphous foil/aluminum dissimilar joint by ultrasonic-assited soldering. Welding in the World 2015, 59: 623-628.(JCR Q3，Impact factor:1.206)
http://dx.doi.org/10.1007/s40194-015-0237-0
17. Hongjun Ji, Junzhao Wanga, Mingyu Li, Evolution of the bulk microstructure in 1100 aluminum builds fabricated by ultrasonic metal welding. Journal of Materials Processing Technology 2014, 214: 175-182.(JCR Q1，Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2013.09.005
16. Hongjun Ji, Shuai Wang, MingyuLi, Jongmyung Kim. Deep crystallization induced high thermal conductivity of low-temperature sintered Ag nanoparticles. Materials Letters 2014, 116: 219-222.(JCR Q2，Impact factor:2.687)
http://dx.doi.org/10.1016/j.matlet.2013.11.030
15. Hongjun Ji, Qiang Wang, Mingyu Li, Chunqing Wang.Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification.Journal of Electronic Materials 2014, 43: 2467-2478.(JCR Q3，Impact factor:1.566)
http://dx.doi.org/10.1007/s11664-014-3113-6
14. YongXiao, HongjunJi, MingyuLi, Jongmyung Kim. Ultrasound-induced equiaxial ower-like CuZn5/Al composite microstructure formation in Al/Zn–Al/Cu joint. Materials Science & Engineering A 2014, 594: 135-139.(JCR Q1，Impact factor:4.432)
http://dx.doi.org/10.1016/j.msea.2013.11.063
13. Hongjun Ji, Qiang Wang, Mingyu Li, Chunqing Wang. Effects of ultrasonic irradiation and cooling rate on the solidification microstructure of Sn–3.0Ag–0.5Cu alloy. Journal of Materials Processing Technology 2014, 214: 13-20.(JCR Q1，Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2013.07.013
12. Yong Xiao, Hongjun Ji, Mingyu Li, Jongmyung Kim. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials & Design 2013, 52: 740-747.(JCR Q1，Impact factor:4.525)
http://dx.doi.org/10.1016/j.matdes.2013.06.016
11. Shuai Wang, Mingyu Li, Hongjun Ji. Chunqing Wang. Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scripta Materialia 2013, 69: 789-792.(JCR Q1，Impact factor:4.163)
http://dx.doi.org/10.1016/j.scriptamat.2013.08.031
10.Yong Xiao, Hongjun Ji, Mingyu Lia, etc. Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn–Al hypereutectic filler metal. Materials & Design 2013, 47: 717–724.(JCR Q1，Impact factor:4.525)
http://dx.doi.org/10.1016/j.matdes.2013.01.004
9. Hongjun Ji, Mingyu Li, Yongfei Lu, Chunqing Wang. Mechanical properties and microstructures of hybrid ultrasonic resistance brazing of WC-Co/BeCu, Journal of Materials Processing Technology, 2012, 212:1885-1891.(JCR Q1，Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2012.04.012
8. Shuai Wang, Hongjun Ji, Mingyu Li, Chunqing Wang, Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles, Materials Letters, 2012, 85:61-63.(JCR Q2，Impact factor:2.687)
http://dx.doi.org/10.1016/j.matlet.2012.06.089
7. Hongjun Ji, Mingyu Li, etc, In situ Measurement of Bond Resistance Varying with Process Parameters during Ultrasonic Wedge Bonding. Journal of Materials Processing Technology, 2009, 209(1): 139-144.(JCR Q1，Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2008.01.036
6. Hongjun Ji, Mingyu Li, etc, Nano Features of Al/Au Ultrasonic Bond Interface Observed by High Resolution Transmission Electron Microscope. Materials Characterization. 2008, 59: 1419-1424.(JCR Q2，Impact factor:2.892)
http://dx.doi.org/10.1016/j.matchar.2008.01.001
5. Heeseon Bang, Hongjun Ji, Mingyu Li, etc. Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-off Method. Materials Science Forum. 2008, 580-582: 173-176.
http://dx.doi.org/10.4028/www.scientific.net/MSF.580-582.173
4. Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Comparison of Interface Evolution of Ultrasonic Aluminum and Gold Wire Wedge Bonds during Thermal Aging. Materials Science & Engineering A, 2007,447 (1-2): 111-118.(JCR Q1，Impact factor:4.432)
http://dx.doi.org/10.1016/j.msea.2006.10.105
3. Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Evolution of the Bond Interface during Ultrasonic Al–Si Wire Wedge Bonding Process. Journal of Materials Processing Technology, 2007,182 (1-3):202-206.(JCR Q1，Impact factor:3.647)
http://dx.doi.org/10.1016/j.jmatprotec.2006.07.033
2. Mingyu Li , Hongjun Ji, Chunqing Wang, etc. Interdiffusion of Al–Ni System Enhanced by Ultrasonic Vibration at Ambient Temperature. Ultrasonics. 2006, 45(1-4): 61-65.(JCR Q2，Impact factor:2.377)
http://dx.doi.org/10.1016/j.ultras.2006.06.058
1. Mingyu Li, Hongjun Ji, Chunqing Wang, etc. Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding. Jounal of Materials Science & Technology 2006, 22(4): 483-486.(JCR Q1，Impact factor:3.609)
https://doi.org/10.1016/j.jmatprotec.2006.07.033
会议论文及发表演说
36. Hongjun Ji, Ultrasonic-assisted sintering of Cu@Ag NPs nanoparticles in air for high-temperature power device packaging. IEEE Nano, Macau, China, July 22-26, 2019. （Invited）
35. Hongjun Ji, Hao Pan, Mingyu Li, A high-efficiency method to fabricate high-melting-point joints by ultrasonic for high-temperature power device packaging, 4th Asia-Oceania Sonochemical Society Conference, Nanjing, China, Sep. 19-21, 2019.（Poster)
34. Wenwu Zhang, Hongjun Ji*, A green sonochemical synthesis of highly efficient, large scale, size-controlled, air-stable, and monodispersed copper@silver core-shell nanoparticles for flexible electronics, 4th Asia-Oceania Sonochemical Society Conference, Nanjing, China, Sep. 19-21, 2019.（Oral）
33. Hongjun Ji, Mingyu Li, Weiwei Zhao, Ultrasonic-accelerated intermetallic joint formation with composite solder for high-temperature power device packaging. ECTC, Las Vegas, NV, USA, May 28-31, 2019.（Oral）
32. 计红军，超声波连接技术进展及其在精密电子制造中的应用，中国焊接机器人发展论坛，Changzhou, China, July 26-27, 2018（邀请报告）
31. 计红军，超声技术在先进焊接和连接中的应用和最新进展，IFWT2018焊接国际论坛，Dongguan, China, May 9th, 2018（邀请报告）
30.Hongjun Ji, Mingyu Li. Ultrasonic-assisted sintering of Cu@Ag nanoparticles paste in air for chip attachment.4th International Conference on Nanojoining and microjoining, Nara, Japan, Dec. 2-5, 2018.（Oral）
29. Jiayi Huang, Hongjun Ji*, Hao Pan, Fanqi Yin, Hao Liu, Jiaao Yu, Mingyu Li.Mechanism of Ni3Sn4 rapid formation of Sn-Ni mixed particles paste in ultrasound-assisted TLP for power electronic chip attachment. IEEE 2018 International Conference on Electronic Packaging Technology, Shanghai, China, Aug.8-11, 2018.（Oral）
28. Hongjun Ji, Mingyu Li. Mechanism of ultrasonic-assisted sintering of Cu@Ag NPs paste in air for high-temperature power device packaging. ECTC, San Diego, California,USA, May 29-June 1, 2018.（Oral）
27. Hongjun Ji, Mingyu Li. Mechanism of ultrasonic-assisted sintering of Cu@Ag NPs paste in air for high-temperature power device packaging. The 7th East Asia Symposium on Technology of Welding and Joining (7th EAST-WJ), Hangzhou, China, Oct. 31 - Nov.1, 2017.（Oral）
26. Hongjun Ji, Mingyu Li. Rapid formation of intermetallic joint during ultrasonic assisted soldering of Sn-based composite solders. 2017 Materials Science and Technology (MS&T17), Pittsburgh, Pennsylvania, USA, Oct. 8-12, 2017.（Oral）
25. Shu Ma, Hongjun Ji*, Junbo Zhou, Huajun Lu, Meng Liang, Minggang Li, Mingyu Li.Rapid Formation of Intermetallic Joints with Sn/Metal Composite Alloys by Ultrasonic-assisted Soldering for High-temperature Chip Attachment. IEEE 2017 International Conference on Electronic Packaging Technology, Harbin, China, Aug.16-19, 2017.（Oral）
24. Hongjun Ji, Mingyu Li. Ultrasonic-induced intermetallic joint with Sn-based solders for high-temperature high-power device packaging. 70th IIW Annual Assembly & International Conference, Shanghai, China, June 25-30, 2017.（Oral）
23. Hongjun Ji, Mingyu Li. Mechanism for Rapid Intermetallic Joint Formation during Ultrasonic-assisted Soldering of Sn-based Composite Solders, International Welding/Joining Conference-Korea (IWJC-Korea 2017), HICO, Gyeongju, South Korea, April 11-14, 2017.（Oral）
22. Hongjun Ji, Minggang Li, Mingyu Li. Ultrasonic-assisted soldering of Sn/Ni composite solder during die bonding for high-temperature application. IEEE 2016 International Conference on Electronic Packaging Technology, Wuhan, China, Aug.16-19, 2016. (Poster)
21. Hongjun Ji, Mingyu Li, Yunfei Qiao. Ultrasonic-assisted soldering of Sn-based solder alloys to form intermetallic interconnects for high temperature application. ECTC, Las Vegas, NV, USA, May 31-June 3, 2016.（Oral）
20. Hongjun Ji. Effects of Ultrasonic Vibration on Undercooling and Microstructures of SAC305 Alloy Solder Joints. 2015 Materials Science and Technology (MS&T15), Columbus, OH, USA, Oct. 4-8, 2015.（Oral）
19. Hongjun Ji, Yunfei Qiao, Mingyu Li. Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application. IEEE 2015 International Conference on Electronic Packaging Technology, Changsha, China, Aug.11-14, 2015.（Oral）
18. Hongjun Ji, Mingyu Li. Progress in ultrasonic-assisted soldering/brazing for joining hard wetted materials. The Fifth East Asia Symposium of Welding and Joining (5th EAST-WJ), Hokkaido, Japan, Sep. 2-3, 2015.（Oral）
17. Hongjun Ji, Hao Chen, Mingyu Li. Microstructures and properties of alumina/copper joints fabricated by ultrasonic-assisted brazing for replacing DBC in power electronics packaging, IEEE 2014 International Conference on Electronic Packaging Technology, Chengdu, China, Aug.12-15, 2014.（Oral）
16.Hongjun Ji, Long Li, Lijie Wang, Mingyu Li. Microstructures and Properties of the Fe-based Amorphous Foil/Aluminum Dissimilar Joint by Ultrasonic-assisted soldering. International Conference on Brazing, Soldering and Special Joining Technologies, Beijing, China, June 9-13, 2014.（Oral）
15. Hongjun Ji, Mingyu Li. Effect of Silver Content in SAC Solder on the Interfacial Reaction and Reliability of the Angle Joints Fabricated by Laser-jet Soldering. 2014 TMS Annual Meeting & Exhibition, SanDiego, FL, US, Feb. 16-20, 2014.（Oral）
14.Hongjun Ji, Xiao Cheng, Hao Chen, et al. Direct Bonding of Alumina Substrate with Copper Heat Sink in Air Assisted by Ultrasonic vibrations for High Power LEDs Devices. IEEE 2013 International Conference on Electronic Packaging Technology, Dalian, China, Aug.11-14, 2013.（Poster)
13. Shuai Wang, Hongjun Ji, Mingyu Li, et al. Pressureless low temperature sintering of Ag nanoparticles for interconnects. 2012 14th International Conference on Electronic Materials and Packaging, HongKong, Dec. 12-16, 2012. （Oral）
12. Hongjun Ji, Junzhao Wang, Mingyu Li. Microstructure evolution of 1100 Al alloy multi-foils during ultrasonic additive manufacturing. IEEE 2012 International Conference on Electronic Packaging Technology, Guilin, China, Aug.13-16, 2012.（Poster)
11. Hongjun Ji, Qiang Wang, Mingyu Li. Effects of ultrasonic vibrations on undercooling and microstructures. IEEE 2012 International Conference on Electronic Packaging Technology, Guilin, China, Aug.13-16, 2012.（Oral）
10. Hongjun Ji, Mingyu Li, Chunqing Wang. Ultrasonic-induced deformation nanostructures in coarse-grained aluminum wires at room termperature. IEEE 2012 International Conference on Electronic Packaging Technology, Guilin, China, Aug.13-16, 2012.（Oral）
9. Hongjun Ji, Masahiko Demura, etc. Diffusion Bonding of Boron-free Ni3Al Foils without Interlayer. The 2009 Autumn Meeting of The Japan Institute of Metals, University of Kyoto, Kyoto, Japan, 2009.（Oral）
8. Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Nanoscale Analysis of Ultrasonic Wedge Bond Interface by Using High-Resolution Transmission Electron Microscopy. IEEE 2008 International Conference on Electronic Packaging Technology & High Density Packaging,Shanghai, China, Aug. 28-31, 2008.（Oral, Best paper)
7. Hongjun Ji, Mingyu Li, etc. Observation of Ultrasonic Al-Si Wire Wedge Bond Interface Using High Resolution Transmission Electron Microscope. IEEE 2007 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.15-17, 2007. （Oral）
6. Han Sur Bang, Hongjun Ji, Mingyu Li, Chunqing Wang. Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-off Method. International Welding/Joining Conference-Korea 2007, Seoul, Korea, May 10-12, 2007.
5. Mingyu Li, Hongjun Ji, Chunqing Wang. Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding. 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006.
4. Hongjun Ji, Mingyu Li, Chunqing Wang. Interfacial Characterization and Bonding Mechanism of Ultrasonic Wedge Bonding. IEEE 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.26-29, 2006: 457-46.（Oral）
3. Mingyu Li, Song Li, Hongjun Ji. Metallurgical Behavior of Au/Al Bond Interface during High Temperature Storage of Ultrasonic Wedge Bonding. IEEE 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.26-29, 2006: 641-644.
2. Mingyu Li, Jingwei Guan, Hongjun Ji. Study on Optimized Processing Parameters and Joint Resistance of Device during Ultrasonic Bonding. IEEE 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.26-29, 2006: 280-282.
1. Ji Hongjun, Li Mingyu, Wang Chunqing. The Diffusion of Ni into Al Wire at the Interface of Ultrasonic Wire Bond during High Temperature Storage. IEEE 2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China, Aug.31-Sep.2, 2005: 377-381. （Oral）
2013-至今 中国电子学会 高级会员
2013-至今 美国矿物，金属，材料学会 （TMS-The Minerals, Metals & Materials Society）会员