个人简历

教育经历
2003年9月-2007年7月 获工学博士学位（材料加工工程）， 哈尔滨工业大学
2001年9月-2003年7月 获工学硕士学位（材料加工工程）， 哈尔滨工业大学
1994年9月-1998年7月 获工学学士学位（金属材料及热处理）， 佳木斯大学工学院
研究与工作经历
2018年1月-至今 哈尔滨工业大学深圳研究生院，材料科学与工程学院，教授，博导
2013年4月-2017年12月 哈尔滨工业大学深圳研究生院，材料科学与工程学院，副教授，博导
2010年8月-2013年4月 哈尔滨工业大学深圳研究生院，材料科学与工程学院，副教授
2009年1月-2010年7月 哈尔滨工业大学深圳研究生院，材料科学与工程学院，助理教授
2008年1月-2008年12月 赫尔辛基工业大学，电子制造技术实验室，博士后，芬兰
2006年1月-2006年7月 悉尼大学，航空，机械及机电工程学院，访问学者, 澳大利亚
科研项目
2014.01-2017.12 国家自然科学基金面上项目
2013.01-2014.09 深圳市战略性新兴产业发展专项资金
2013.03-2014.06 深圳市亿铖达工业有限公司合作项目
2012.10-2014.12 深圳市高层次人才创新创业专项资金
2010.01-2012.12 国家自然科学基金青年基金
2014.06-2014.12 东方红海特卫星有限公司合作项目
科研成果及奖励
2010年 深圳市地方级领军人才
2017年 深圳市南山区领航人才
发明专利
1. 陈宏涛，王帅，李明雨，一种Cu@Sn核壳结构高温钎料及其制备方法，专利号：201310739337X
2. 陈宏涛，赵孟辉，一种基于Ni@Sn核壳结构的高温钎料的制备方法，专利申请号：20161065385872.
3. 陈宏涛，王斌，一种基于Ag@Sn核壳结构的高温钎料制备方法，专利申请号：2016105644860
4. 陈宏涛，胡天麒，李明雨，梁轩领，范萍，白文斌，一种微纳米铜球表面镀附具有可焊性厚度的厚锡层的镀附方法，专利申请号：2015106643343
5. 陈宏涛，习聪，郭强,一种基于Ag@In核壳结构的高温钎料及其制备方法，专利申请号:2017104709595
5. 陈宏涛，王帅，李明雨，一种新型预制片高温钎料及其制备方法，专利号：2014103931414
6. 马鑫、陈宏涛、胡天麒、李明雨、杨明， 一种复合无铅钎料制备过程中添加微量元素的方法，专利号：
2013102844062
7.陈宏涛，胡天麒，李明雨，杨明，马鑫，一种局部强化的高可靠性钎料及其制备方法，专利号：201310207421.7
8. 陈宏涛，杨雨风，一种基于电镀的同种或异种金属的连接方法，专利申请号：2016105755740
任教和任导师经历
1.毕业博士： 汉晶，博士，已毕业，北工大任教；胡天麒，博士，华为上海终端；
2.在读博士： 于福文，15级博士，在读；王建强，17级博士，在读；刘昊，18级博士，在读；张珞斌，19级博士，在读，张微微，19级博士，在读；
3.毕业硕士： 许家誉，硕士，腾讯; 祝俊璋，硕士，大疆;王康， 硕士，石家庄54所； 李自平，硕士，南科大； 胡天麒，硕士，华为；高源，硕士，八院；邹坤，硕士，华为；刘敬东，硕士，华为；付兴，硕士，广州五所；王帅，硕士，华为；张志鑫，硕士，八院；马晓萌，硕士，八院；范萍，硕士，八院；白文斌，硕士，八院；梁轩领，硕士，华三通信；李准，硕士，华为；赵孟辉，硕士，华为；杨雨风，硕士，华为；黄梦诗，硕士，留校；王斌，硕士，全志；郭强，硕士，55所；习聪，硕士，55所；何军健，硕士，23所；赵夫凡，硕士，23所；孙思雨，硕士，中科院先进院；谢星驰，硕士，华为；苏悦，硕士，华为；马杰，硕士，55所；李长青，华为，王永杰，去哪网
4.在读硕士： 刘加豪，廖超，刘敏，陈文彤，徐可新，王鑫杰，毛星超，王奉祎

研究领域

电子封装互连材料、技术与可靠性：功率器件芯片贴装用低温连接高温服役材料；核壳复合金属材料；严苛条件下服役焊点可靠性；焊点界面反应；晶体取向对焊点可靠性影响等""

近期论文

1. H.T.Chen*, T.Q. Hu, M.Y. Li, Z.Q. Zhao, Cu@Sn Core – Shell StructurePowder Preform for Hightemperature Applications Based on Transient Liquid Phase Bonding, IEEE Transactions on Power Electronics, 32(2017)441.
2. J.D. Liu#,H.T.Chen#, H.J. Ji, M.Y. Li, Highly conductive Cu-Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticles, ACS Applied Materials&Interfaces, 8(2017)33289，#: Contributed equally.
3.Fuwen Yu, Hao Liu, Chunjin Hang*,Hongtao Chen*, Mingyu Li,Rapid formation of full intermetallic bondlines for die attachment in high temperature power devices based on micro-sized Sn-coated Ag particles,JOM, Volume 71, Issue 9, pp 3049–3056.
4.Xing Fu, Yunfei En, Bin Zhou, Si Chen, Yun Huang, Xiaoqi He,Hongtao Chen and Ruohe Yao*, ,Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature, Materials, 12(2019)1593.
5. F.W. Yu, C.J. Hang, M.H. Zhao, H.T. Chen, An interconnection method based on Sn-coated Ni core-shell Powder Preforms for High-Temperature Applications, Journal of Alloys and Compounds, 776(2019)791.
6.Yue Su, Chunjin Hang*, Hongtao Chen*, Xingchi Xie, Jie Ma, Mingyu Li, Interconnection method based on solder-filled nanoporous copper as interlayer for high-temperature applications， Microelectronic Engineering, 214(2019) 60.
7. C.J. Hang, J.J. He, Z.H. Zhang, H.T. Chen*, M.Y. Li, Low temperature bonding by infiltrating porous Ag with Sn3.5Ag solder paste for die attachment in power device packaging,Sicentific Reports, 8(2018)17422
8.F.W. Yu, H.T. Chen*, C.J. Hang, M.Y. Li, Fabrication of high-temperature resistant bondline based on multilayer core–shell hybrid microspheres for power devices, Journal of Materials Science: Materials in Electronics, 2019,In press.
9.Bo Hu , Fan Yang , Ye Peng , Chunjin Hang*, Hongtao Chen , Changwoo Lee , Shihua Yang , Mingyu Li *, Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high 9temperature applications, Journal of Materials Science: Materials in Electronics, In press.
10. Xingchi XIE,Chunjin Hang,Jianqiang Wang,Yue Su,Jie Ma,Qiang Guo,Hongtao Chen*, Mingyu Li, A low temperature die attach technique for high temperature applications based on Indium infiltrating micro-porous Ag sheet, Journal of Materials Science: Materials in Electronics, 29 (2018) 18302.
11. Dong Wang, Jianhua Zhu,Shangheng Wang, Hongtao Chen,Xingjun Liu, Cuiping Wang, Experimental Investigation and Thermodynamic Calculation of Phase Equilibria in the Mg-Pb-Sn Ternary System, J. Phase Equilib. Diffus. 39 (2018)324
12. Jiahui Gu, Xuelin Wang, Hongtao Chen*, Shihua Yang,Huanhuan Feng, Xing Ma, Hongjun Ji, Jun Wei and Mingyu Li*, Conductivity enhancement of silver nanowire networks via simple electrolyte solution treatment and solvent washing, nanotechnology,29 (2018) 265703.
13. T.Q. Hu, H.T. Chen*, M.Y. Li, C.Q. Wang, Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions Materials and Design, 131(2017)196. （IF:4.364）
14. T.Q. Hu，H.T. Chen*, C.Q. Wang, M.S. Huang, F.F. Zhao, Study of electroless Sn-coated Cu microparticles and their application as a high temperature thermal interface material, Surface&coatings technology, 319(2017)230.
15. F.W. Yu, Q. Guo, B. Wang, X. Ma, M.Y. Li, H.T. Chen*, Ag@Sn Core-shell Powder Preform with a High Re-melting Temperature for High-temperature Power Devices Packaging, Advanced Engineering Materials，2017，DOI:10.1002/adem.201700524.
16. Qiang Guo, Fuwen Yu, Hongtao Chen*, Mingyu Li, Microstructure Evolution during Reflow and Thermal Aging in a Ag@Sn TLP Bondline for High-temperature Power Devices, Journal of materials Science: materials in electronics, 2017， DOI: 10.1007/s10854-017-8232-4.
17. Q.Guo, S. Sun, Z.H. Zhang, H.T. Chen*, M.Y. Li, Microstructure Evolution and Mechanical Strength Evaluation in Ag/Sn/Cu TLP Bonding Interconnection during Aging Test,Microelectronics Reliability,2017, DOI:10.1016/j.microrel.2017.12.001.
18. S.Y. Sun,Q. Guo,H.T. Chen*, M.Y. Li*, C.Q. Wang, Solderless Bonding with Nanoporous Copper as Interlayer for Hightemperature Applications, Microelectronics Reliability, DOI: 1016/j.microrel.2017.12.012.
19. Z.H. Zhang, H.J. Cao, H.T. Chen, Formation mechanism of a cathodic serrated interface and voids under high current density, Materials letter, 211(2018)191.
20. Y.F. Yang, H.T.Chen*, M.Y. Li, Dissimilar copper-aluminum joint processed by low-temperature nickel electroplating, Journal of Materials Processing Technology, 242(2017)68.
21.T.Q. Hu, H.T.Chen*, M.Y. Li, Die Attach Materials with High Remelting Temperatures Created by Bonding Cu@Sn Microparticles at Lower Temperatures, Materials and Design, 108(2016)383.
22. C.L. Mai, J.Y. Sun, H.T.Chen*, C.K. Mai, M.Y. Li, Silicon direct bonding via low-temperature wet chemical surface activation,？RSC Advances, 6(2016)37079.
23. H.T. Chen, C.J. Hang, X. Fu, M.Y. Li, Microstructure and Grain Orientation Evolution in Sn3.0Ag0.5Cu Solder Interconnects under Electrical Current Stressing, Journal of Electronic Materials, 44(2015)3880.
24. M. Yang, H. Chen, X. Ma, M. Li, Y. Cao, J. Kim, Solid-state interfacial reaction of eutectic Sn3. 5Ag and pure tin solders with polycrystalline Cu substrate, Journal of Materials Science, 49(2014)3652.
25. H.T. Chen, B.B. Yan, M. Yang, X. Ma, M.Y. Li, Effect of grain orientation on mechanical properties and thermomechanical response of Sn-based solder interconnects, Materials Characterization,Vol.85(2013)64.
26. M. Yang, Y. Cao, S.M. Joo, H.T. Chen, X. Ma, M.Y. Li, Cu6Sn5 Precipitation during Sn-based solders/Cu joints solidification and its effects on the growth of interfacial intermetallic compounds, Journal of Alloys and Compounds, Vol.582(2014)688.
27. L. Wang, C. Wan, Y.G Fu, H.T. Chen, X.J. Liu, M.Y. Li. Study on the effects of adipic acid on properties of dicyandiamide-cured electrically conductive adhesives and the interaction mechanism. Journal of Electronic Materials，43(2014)132.
28. L. Wang, C. Wan, H.Q. Wang, H.T. Chen, X.M. Zhu, M.Y. Li, Electrical property improvement of dicyandiamide-cured electrically conductive adhesives through in-situ replacement by difunctional acids and the impact on storage, International Journal of Adhesion&Adehsives, Vol.45(2013)132.
29. J. Han, H.T. Chen, M.Y. Li, Shear deformation behaviors of Sn3.5Ag lead-free solder samples, Journal of Materials Science and Technology, Vol.29 (2013)471.
30. 许家誉，陈宏涛*，李明雨，基于晶体取向的无铅互连焊点可靠性研究，金属学报，48(2012)1042.
31. H.T. Chen, J. Li, M.Y. Li, Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress, Journal of Alloys and Compounds, Vol.540(2012)32.
32. H.T. Chen, J. Han, J. Li, M.Y. Li, Inhomogeneous Deformation and Microstructure Evolution of Lead-free Solder Interconnects during Thermal Cycling and Shear Testing, Microelectronics Reliability, Vol. 52(2012)1112.
33. H.T. Chen, L. Wang, J. Han, M.Y. Li, H. Liu, Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress, Microelectronic Engineering, Vol.96 (2012) 82.
34. J. Han, H.T. Chen, M.Y. Li, The role of crystal orientation in the failure of Sn3.0Ag0.5Cu solder joints under thermomechanical fatigue, Acta Metallurgica Sinica (English Letters), Acta Metall. Sin.(Engl. Lett.), Vol.25(2012)214.
35. J. Li, M. Turunen, S. Niiranen, H. Chen, M. Paulasto-krockel, A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive, Microelectronics Reliability, 52(2012)2962.
36. H.T. Chen, M. Mueller, T.T. Mattila, J. Li, X.W. Liu, K.-J. Wolter, M.
Paulasto, Localized Recrystallization and Cracking of Lead-Free Solder Interconnections under Thermal Cycling, J. Mater. Res., Vol. 26 (2011) 2103.
37. H.T. Chen, L. Wang, J. Han, M.Y. Li, Q.B. Wu, Grain orientation evolution and deformation behaviors in Pb-free solder interconnects under mechanical stresses, Journal of Electronic Materials, Vol.40 (2011) 2445.
38. H.T. Chen, J. Han, M.Y. Li, Localized recrystallization induced by subgrain rotation in Sn3.0Ag0.5Cu ball grid array solder interconnects during thermal cycling, Journal of Electronic Materials, Vol.40 (2011) 2470.
39. J. Li, H. Xu, J. Hokka, T. T. Mattila, H.T. Chen, M. Paulasto-Kr？ckel, Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests, Soldering and Surface Mount Technology. vol.23(3),(2011) 161.
40. H.B. Xu, M.Y. Li, H.T. Chen, Y.G. Fu, and L. Wang, Lead-free bumping using an alternating electromagnetic field, Journal of Electronic Materials, Vol. 36, No. 1, (2009) 33.
41. H. Chang, H.T. Chen, M.Y. Li, L. Wang, Y.G. Fu, Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water, Journal of Electronic Materials, vol.38, No. 10, (2009) 2170.
42. H.T. Chen*, C.Q. Wang, Cheng.Y, and Y. Huang, Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints, Journal of Electronic Materials, Vol. 36, No. 1, (2007) 26.
43. H.T. Chen*, C.Q. Wang, Cheng.Y, M.Y. Li, and Y. Huang, Cross-interaction of interfacial reactions in Ni (AuNiCu)-SnAg-Cu solder joints during reflow soldering and thermal aging, Journal of Electronic Materials, Vol. 36, No. 1, (2007) 33.
44. H.T. Chen*, C.Q. Wang, M.Y. Li, and D.W. Tian, Effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu and SnPb solders with Au/Ni/Cu substrate during aging, Materials Letters, 60 (2006) 1669.
45. H.T. Chen*, C.Q. Wang, M.Y. Li, Y.H. Tian, Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability, Journal of Materials Science and Technology, 21(2005) 419.
46. H.T. Chen*, C.Q. Wang, and M.Y. Li, Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling, Microelectronics Reliability, 46 (2006) 1348.
47. H.T. Chen*, C.Q. Wang, M.Y. Li, and D.W. Tian, Effect of thermal aging on the microstructure evolution and solder joint reliability in hard disk drive under mechanical shock, IEEE Transactions on Component and Packaging Technology, 31 (2008) 831.
48. H.T. Chen*, C.Q. Wang, M.Y. Li, and D.W. Tian, Influence of thermal cycling on the microstructure and shear strength of Sn3.5Ag0.75Cu and Sn63Pb37 solder joints on Au/Ni metallization, Journal of Materials Science and Technology, 23(2007) 68.