个人简历

教育及工作经历
1999.07-2003.03 哈尔滨工业大学，材料学院，工学博士
2003.03-2005.12 哈尔滨工业大学，材料学院，讲师
2004.08-2005.08 加拿大滑铁卢大学，机械工程系，博士后
2006.06-2006.08 美国马里兰大学，电子封装可靠性中心，访问学者
2006.01-2012.11 哈尔滨工业大学，材料学院，副教授
2011.03- 哈尔滨工业大学，材料学院，博导
2012.12 哈尔滨工业大学，材料学院，教授
2013.11- 哈尔滨工业大学，焊接科学与工程系，主任
2013.11- 哈尔滨工业大学，先进焊接与连接国家重点实验室，副主任

近期论文

1. Baolei, Liu; Yanhong, Tian*; Wei, Liu; Weiwei, Wu; Chunqing, Wang. TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows. Materials Letters, v 163, p 254-257, 2016
2. Su, Ding; Jinting, Jiu*; Yanhong, Tian*; Tohru, Sugahara; Shijo, Nagao; Katsuaki, Suganuma. Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air. Physical Chemistry Chemical Physics, v 17, p 31110-31116, 2015
3. Su, Ding; Yanhong, Tian*; Zhi, Jiang; Xiaobin, He. Molecular dynamics simulation of joining process of Ag-Au nanowires and mechanical properties of the hybrid nanojoint. AIP Advances, v 5, 057120, 2015
4. Su Ding; Yanhong Tian*; Zhi Jiang; Chunqing Wang. Joining of silver nanowires by femtosecond laser methods. Materials Transactions, v 56, p 981-983, 2015
5. 江智，田艳红*，丁苏. Sn3.5Ag0.5Cu纳米颗粒钎料制备及钎焊机理，金属学报 2015
6. Ying, Ding; Ruyu, Tian; Xiuli, Wang; Chunjin, Hang; Fang, Yu; Ling, Zhou; Xiangang, Meng; Yanhong, Tian. Coupling Effects of Mechanical Vibrations and Thermal Cycling on Reliability of CCGA Solder Joints. Microelectronics Reliability, v 55, n 11, p 2396-2402, 2015
7. Rong, An; Yanhong, Tian*; Rui, Zhang; Chunqing, Wang. Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints. Journal of Materials Science: Materials in Electronics, v 26, p 2674-2681, 2015
8. Yanhong, Tian*; Chunjin, Hang; Xin, Zhao; Baolei, Liu; Ning, Wang; Chunqing, Wang. Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid-liquid interdiffusion bonding. Journal of Materials Science: Materials in Electronics, v 25, p 4170-4178, 2014
9. Zhi, Jiang; Yanhong, Tian*; Su, Ding. Synthesis andcharacterization of ultra-long and pencil-like copper nanowires with a penta-twinned structure by hydrothermal method. Materials Letters, v 136, p 310-313, 2014
10. 田艳红*，贺晓斌，杭春进. 残余应力对混合组装BGA 热循环可靠性影响， v 50, p 2, p 86-91, 2014
11. Yanhong, Tian*; Rui, Zhang; Chunjin, Hang; Lina, Niu; Chunqing, Wang. Relationship between morphologies and orientatios of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads. Materials Characterizaton, v 88, p 58-68, 2014
12. Rui, Zhang; Yanhong, Tian*; Chunjin, Hang; Baolei, Liu; Chunqing Wang. Formation mechanism and orientation of Cu3Sn grains in Cu-Sn intermetallic compound joints. Materials Letters, v 110, p 137-140, 2013
13. Chunjin, Hang; Yanhong, Tian*; Rui Zhang; Dongsheng Yang. Phase transformation and grain orientation of Cu-Sn intemetallic compounds during low temperature bonding process. Journals of Materials Science: Materials in Electronics, v 24, n 10, p 3905-3913, 2013
14. Wei Liu; Yanhong Tian; Chunqing Wang; Lining Sun. Formation of AuSnx IMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow process. Journal of Materials Science: Materials in Electronics, v 24, p 217-223, 2013
15. Yang, Lei; Liu, Wei; Wang, Chunqing; Tian, Yanhong. Surface-Tension-Driven Self-Assembly of 3-D Microcompounds by Using Laser Reflow Soldering and Wire Limiting Mechanisms. IEEE Transactions on Components Packaging and Manufacturing Technology, v 3, n 1, p 168-176, 2013
16. 田艳红*，贺晓斌，杭春进. 残余应力对混合组装BGA热循环可靠性影响，机械工程学报 2013
17. 杭春进，田艳红*，赵鑫，王春青. 混装BGA器件高温老化实验焊点微观组织研究，金属学报 v 7, n 49, p 831-837, 2013
18. 杭春进，田艳红*，王春青. 细径铜丝超声键合焊点高温存储可靠性分析，焊接学报 v 2, n 34, p 13-16, 2013
19. 刘威，窦广彬，王春青，田艳红，叶交托. 激光诱发前向转移技术在电子制造领域的应用，电子工艺技术 v 2, n 34, p 70-72, 2013
20. Tian, Yanhong*; Liu,Wei; An, Rong; Zhang, Wei; Niu, Lina; Wang, Chunqing. Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test. Journal of Materials Science: Materials in Electronics, v 23, n 1, p 136-147, 2012