个人简历

程娥，工学博士，硕士生导师，JMM、MICROFLUID NANOFLUID等国际期刊审稿专家。2015年3月在大连理工大学机械工程专业获得博士学位，2015年7月通过人才引进至河北工业大学机械工程学院工作至今。主持和参与国家自然科学基金、河北省基金、河北省教育厅基金等多项课题，发表SCI论文10余篇，申请发明专利3项。
教育经历工作经历
2015年3月，博士毕业于大连理工大学机械工程学院，机械工程专业。
2015年7月，就职河北工业大学机械工程学院，机械设计制造及其自动化专业。

研究领域

1)微纳结构及器件的加工成型技术
2)微电子机械系统（MEMS）；
3)微纳流控芯片系统技术；"专利
1.邹赫麟，殷志富，程娥. 一种制备纳米通道断面形貌样品的置换表征方法. 中国

近期论文

1. E Cheng, Suzhou Tang, Chen Li, Helin Zou, and Qiang Wei. Nano-patterns of photoresist fabricated by ultraviolet lithography technology Journal of nanoscience and nanotechnology, 2019, 20(4), 2508-2513.
2. Zhifu Yin, E Cheng, and Helin Zou. Fast Microfluidic Chip Fabrication Technique by Laser Erosion and Sticky Tape Assist Bonding Technique. 2018, 18, 4082–4086.
3. Zhifu Yin, E. Cheng, Helin Zou. Numerical study on the shrinkage behavior of SU8 patterns. 2017, 23(10), 4957–4964.
4. E Cheng, Zhifu Yin, Helin Zou, Li Chen. Surface modification-assisted bonding of 2D polymer-based nanofluidic devices. Microfluidics and Nanofluidics. 2015，10(3),527-535
5. E Cheng, Helin Zou, Zhifu Yin, Petr Jur?í?ek and Xi Zhang. Fabrication of 2D polymer nanochannels by sidewall lithography and hot embossing. Journal of Micromechanics and Microengineering, 2013, 23, 075022.
6. E Cheng, Helin Zou, Zhifu Yin and Petr Jur?í?ek. Experiment and numerical study on deformation behavior of polyethylene terephthalate two-dimensional nanochannels during hot embossing process. Journal of Micromechanics and Microengineering, 2014, 24, 015004.
7. Zhifu Yin, E Cheng, Helin Zou, Petr Jur?í?ek. Analysis of the polymer viscoelastic properties based on a compress creep tests in hot embossing for 2D PET nanochannels. Polymer Engineering and Science,2014, 54: 2398-2406.（SCI、EI 检索，SCI 影响因子1.670）
8. Zhifu Yin, E Cheng, Helin Zou. A novel hybrid patterning technique for micro-and nano channels fabrication by integrating hot embossing and inverse UV photolithography. Lab on a Chip, 2014, 14:1614-1621.
9. Zhifu Yin，E Cheng，Helin Zou，Li Chen，Shenbo Xu，Fabrication of two dimensional polyethylene terephthalate nanofluidic chip using hot embossing and thermal bonding technique [J]. Biomicrofluidics，2014，8（6）：066503.
JMM、MICROFLUID NANOFLUID等国际期刊审稿人，中国微米纳米技术学会 高级会员。