个人简历

长期从事电力系统电磁兼容、高速电路电源网络及IC高级封装电磁兼容、电子设备电磁兼容抗扰度等方面的建模与仿真分析研究工作，近年来发表论文近20篇，其中第一作者发表论文12篇，SCI 收录国际期刊文章3篇，一级学报1篇，EI收录文章10余篇。和中国电科院、全球能源互联网研究院等单位合作完成国家电网直流输电换流阀、智能变电站电磁兼容科技项目多项，参与完成国家自然科学基金项目多项。

研究领域

电力系统电磁兼容；电磁场与微波技术；大功率半导体器件模型。"科研项目：
1.中央高校基本研究业务费专项资金资助项目，12MS125，通体硅异质封装转接层电热光兼容分析，2012.4-2015.4，8万元，已结题，主持
2.国家电网公司科技项目，智能电子装置电磁兼容失效机理及防护措施研究，2013/01-2014/09，90万元，已结题，主研
3.中央高校基本研究业务费专项资金资助项目，2016MS95，瞬态电磁脉冲下硅通孔互连引入的失效研究

近期论文

1.Guangxiao Luo, Erping Li, Xingchang Wei, Xiang Cui, Ran Hao. PDN Impedance Modeling for Multiple Through Vias Array in Doped Silicon[J]. IEEE Transactions on Electromagnetic Compatibility, vol.56, no.5, pp.1202-1209, October 2014.(SCI收录号WOS: 000343060700025)
2.Guangxiao Luo, Xingchang Wei, Ran Hao, Xiang Cui, Erping Li. Full RLGC Model Extraction of Through Silicon Via (TSV) with Charge Distribution Effects[J]. Journal of Electromagnetic Waves and Applications,vol.28, no.13, pp.1596-1609, July 2014. (SCI收录号WOS: 000342313300003)
3.罗广孝, 崔翔, 张卫东, 等. TVS静电抑制器等效电路参数估算及应用[J]. 中国电机工程学报, 33(16), pp.204-211, 2013.(EI收录号: 20132616454343)
4.罗广孝, 马海杰. 0.6μm CMOS工艺折叠共源共栅运算放大器设计[J]. 华北电力大学学报, 35(3), pp.103-106, 2008.
5.Luo Guang-xiao, Qi Lei, Kang Wei, Zhao Guo-liang. Parameter Extraction for Trench-Gated Field-Stop IGBT Model[C]. The 7th International Conference on Electromagnetic Field Problems and Applications(ICEF 2016). Xi’an, China. September 18-20, 2016.
6.Luo Guang-xiao, Zhang Wei-dong, Qi Lei, Zhao Guo-liang. Voltage-Dependence Capacitance System Calculation of Trench-Gated IGBT[C]. 2016 International Symposium on Electromagnetic Compatibility(EMC EUROPE 2016). Proceedings, Wroclaw, Poland. September 5-9, 2016.(EI收录号: 20165003106266)
7.Luo Guang-xiao, Zhang Wei-dong, Wei Xing-chang. Miniature Optical Signal Transmission System for PDN Noise Measurement[C]. 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility / Signal Integrity (APEMC 2016), Shenzhen, China, 17-22 May 2016. (EI收录号: 20163502760776)
8.Guangxiao Luo, Erping Li, Xingchang Wei, Xiang Cui. Modelling of planar EBG structure by using equivalent circuit method[C]. 2015 IEEE International Symposium on Electromagnetic Compatibility, Dresden, Germany, 16-22 Aug. 2015. (EI收录号: 20160201798616)
9.Guangxiao Luo, Erping Li, Xingchang Wei, Xiang Cui. Capacitive Coupling Analysis of TSV Array in 3D Packaging[C]. The XXXIst General Assembly and Scientific Symposium (GASS) of the International Union of Radio Science (Union Radio Scientifique Internationale-URSI) URSI GASS2014 Beijing, 16-23 Aug. 2014. (EI收录号: 20145200377487)
10.Guangxiao Luo, Xiang Cui, Weidong Zhang, Xingchang Wei, Erping Li. Modeling and Analysis for EBG Structure of Power Planes by Using Equivalent Circuit Method[C]. The Ninth International Conference on Computation in Electromagnetics, CEM 2014, 31 March – 1 April 2014, Imperial College London, UK.(EI收录号: 20142417821144)
11.[11]Guangxiao Luo, Xiang Cui, Xingchang Wei, Erping Li. Distributed Decoupling Analysis on PG Planes for PDN Design[C]. 2012 International Symposium on Electromagnetic Compatibility(EMC EUROPE 2012). Proceedings, Rome, Italy. September 17-21, 2012.(EI收录号: 20130415937519)
12.[12]Guangxiao Luo, Xingchang Wei, Xiang Cui, Erping Li. Analytical Extraction of Via-via Inductance by Using SMM for Power-ground Planes[C]. 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011, Hangzhou, China, December 12-14, 2011.(EI收录号: 20123115286013)