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刘芳
2023-05-10 11:38
  • 刘芳
  • 刘芳 - 博士后-广东工业大学-环境生态工程研究院-个人资料

近期热点

资料介绍

个人简历


刘芳,博士,毕业于中南大学,现为广东工业大学环境生态工程研究院博士后

教育经历
2013-2018,中南大学,博士生,获博士学位;
2010-2013,湖南农业大学,硕士生,获硕士学位;
2006-2010,湖南农业大学,本科生,获学士学位。

工作经历
2019-至今 广东工业大学环境生态工程研究院博士后

2015年硕士研究生学业二等奖

研究领域


铁系材料的制备,铁系材料对废水处理的理论与技术""

近期论文


1.F. Liu,K.G.Zhou, W. Chen, Q.Z. Chen, A.H. Wang.Application of magnetic ferrite nanoparticles for removal of Cu(II)from copper-ammonia wastewater. Journal ofAlloys and Compounds. 2018, 773: 140-149.
2.F. Liu,K.G.Zhou, Q.Z. Chen, A.H. Wang, W. Chen. Preparation of magnetic ferrite by optimizing the synthetic pH and its application for the removal of Cd(II) from Cd-NH3-H2Osystem. Journal of Molecular liquids, 2018, 264: 215-222.
3.F. Liu,K.G.Zhou, Q.Z. Chen, A.H. Wang, W. Chen. Comparative study on the synthesis of magnetic ferrite adsorbent for the removal of Cd(II) from wastewater. Adsorption Science & Technology, 2018,36: 1456-1469.
4. Wang, AH; Zhou, KG; Liu, X;Liu, F; Zhang, C; Chen, QZ. Granular tri-metal oxide adorbent for fluoride uptake: Adsorption kinetic and equilibrium studies. Journal of Colloid and Interface Science, 2017, 505:947-955.
5. Wang, AH; Zhou, KG; Liu, X;Liu, F; Zhang, C; Chen, QZ. Development of Mg-Al-La tri-metal mixed oxide entrapped in alginate for removal of fluoride from wastewater. Rsc Advances, 2017, 7(50): 31221-31229.
6. Chen, QZ; Zhou, KG; Chen, Y; Wang, AH;Liu, F. A novel poly ligand exchanger- Cu(II)-loaded chelating resin for the removal of ammonia-nitrogen in aqueous solution. Environmental Technology, 2017, 38(22): 2824-2834.
7. Chen, QZ; Zhou, KG; Hu, YJ;Liu, F; Wang, AH. Effect of competing ions and causticization on the ammonia adsorption by a novel poly ligand exchanger (PLE) ammonia adsorption reagent. Water Science and Technology, 2017, 75(6): 1294-1308.
8. Chen, QZ; Zhou, KG; Chen, Y; Wang, AH;Liu, F. Removal of ammonia from aqueous solutions by ligand exchange onto a Cu(II)-loaded chelating resin: kinetics, equilibrium and thermodynamics. Rsc Advances, 2017, 7(21): 12812-12823.

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