Wang Lei, Wang Jun*, Xiao Fei. Study on BEOL failures in a Chip by Shear Tests of Copper Pillar Bumps[J]. Journal of Electronic Packaging, 2019. Yang Chen, Wang Lei, Yu Kehang, Wang Jun*. Assess low-k/ultralow-k materials integrity by shear test on bumps of a chip[J]. Journal of Materials Science: Materials in Electronics, 2018, 29(19): 16416–16425. Wang Jun, Yuan Bo, Han R P S*. Modulus of elasticity of randomly and aligned polymeric scaffolds with fiber size dependency[J]. Journal of the Mechanical Behavior of Biomedical Materials, 2018, 77(Supplement C): 314–320. Wang Lei, Song Congshen, Wang Jun*, Xiao Fei, Zhang Wenqi, Cao Liqiang. A wet etching approach for the via-reveal of a wafer with through silicon vias[J]. Microelectronic Engineering, 2017, 179(Supplement C): 31–36. Lin Lin， Wang Jun*，Wang Lei，Zhang Wenqi，The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process，Microelectronics Reliability，2016.10.01，65：198~204 Wang Lei，Xu Chen，Lin Lin，Yang Chen，Wang Jun*，Xiao Fei，Zhang Wenqi，Thermal stress analysis of the low-k layer in a flip-chip package，Micro electronic Engineering，2016.9.1，163：78~82 Yuan Bo， Wang Jun*，Han R.P.S.*，Capturing tensile size-dependency in polymer nanofiber elasticity，Journal of the Mechanical Behavior of Biomedical Materials，2015.2.1，42（2）：26~31 Pang Junwen， Wang Jun*，The Thermal Stress Analysis for IC Integrations with TSV Interposer by Complement Sector Models，Journal of Electronic Materials，2014.9.01，43（9）：3423~3435 Ma He，Yu Daquan， Wang Jun*，The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer，Microelect ronics Reliability，2014.2.01，54（2）：425~434
