热点话题人物,欢迎提交收录!
最优雅的名人百科,欢迎向我们提交收录。
黄正兴
2023-05-09 16:32
  • 黄正兴
  • 黄正兴 - 博士 副教授 硕导-大连理工大学-生物医学工程学院-个人资料

近期热点

资料介绍

个人简历


个人简介
Personal Profile
本科毕业于大连理工大学物理系,博士毕业于大连理工大学电信学院。2014-2015在美国Purdue University做访问学者。
主要的研究方向是微纳尺度下材料的热特性,重点是测试方法以及计算机模拟方法的研究。
薄膜材料在集成电路芯片、热电材料、相变存储器、核聚变反应实验装置、航空发动机等领域得到广泛应用,它们的热物性与器件性能紧密相关。
目前,已经开发的测试系统有纳秒激光瞬态热反射方法、3omega方法,交流量热法等,计算机模拟主要采用分子动力学方法,利用Material Studios和LAMMPS等软件。
教育经历
1996.9 2000.6 大连理工大学 学士
2000.9 2007.3 大连理工大学 微电子与固体电子学 博士
工作经历
2007.3 至今 大连理工大学电信学院
科研项目
离子注入及等离子体辐照样品损伤表层热导分析测试, 其他课题, 2016/09/15-2017/09/15, 完成
纳米管与石墨烯复合结构热界面材料的热学性能研究, 省、市、自治区科技项目, 2016/07/19, 进行
等离子体辐照样品损伤表层热导分析测试, 企事业单位委托科技项目, 2015/04/15-2016/04/15, 完成
金属表面辐照损伤热导测试, 其他课题, 2015/09/01-2016/01/20, 完成
MEMS气体传感器气敏材料的EHD微滴打印关键技术研究, 国家自然科学基金项目, 2018/09/01, 进行
微流体染料2017, 其他课题, 2017/09/01, 进行
授课信息
数字电路与系统B /2019-2020 /春学期 /48课时 /3.0学分 /1020230310
数字电路与系统B /2019-2020 /春学期 /48课时 /3.0学分 /1020230310
数字电子技术 /2019-2020 /秋学期 /44课时 /2.5学分 /1020440121
数字电子技术 /2019-2020 /秋学期 /44课时 /2.5学分 /1020440121
数字电路与系统B /2018-2019 /春学期 /48课时 /3.0学分 /1020230310
半导体物理 /2018-2019 /秋学期 /48课时 /3.0学分 /1020240030

研究领域


计算机模拟,主要通过分子动力学等方法计算不同结构下的热特性
薄膜热导率的测试方法研究,主要研究相关的测试方案,如瞬态热反射方法,3 omega方法等
微结构热特性的分析,主要研究微结构的不同导致热性能的变化"研究领域
微纳尺度材料热学性能
微尺度材料热特性的测试方法
微尺度材料热特性的计算机模拟"

近期论文


[1]He, Tiantian,Li, Ting,Huang, Zhengxing,Tang, Zhenan,Guan, Xiangyu.Mechanical and thermal properties of the coaxial carbon nanotube@boron nitride nanotube composite[J],PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES,2019,107:182-186
[2]贺天天,李婷,黄正兴,唐祯安.Mechanical and thermal properties of the coaxial carbon nanotube@boron[J],Physica E,2019,107:182-186
[3]Qu, Shilian,Tang, Zhenan,Jia, Yuzhen,Lian, YouYun,Liu, Xiang,Liu, Wei,Sun, Hao,Kreter, Arkadi,Yuan, Yue,Cheng, Long,Huang, Zhengxing,Xu, Ben,Chen, Wanqi,Cui, Wei.Degradation of thermal conductivity of the damaged layer of tungsten irradiated by helium-plasma[J],FUSION ENGINEERING AND DESIGN,2018,137:97-103
[4]黄正兴,孙豪,李奇松,管相宇.InSb薄膜热导率温度特性及传热机理[J],大连理工大学学报,2018,58(5):519-525
[5]Li, Ting,Tang, Zhenan,Huang, Zhengxing,Yu, Jun.Substrate effects on the thermal performance of in-plane graphene/hexagonal boron nitride heterostructures[J],CARBON,2018,130:396-400
[6]曲世联,陈婉琦,黄正兴.He注入对W在瞬态热负荷条件下熔化行为的影响[J],稀有金属,2018,28:283-
[7]Li, Qisong,Wei, Jingsong,Sun, Hao,Zhang, Kui,Huang, Zhengxing,Zhang, Long.Temperature dependent thermal conductivity and transition mechanism in amorphous and crystalline Sb2Te3 thin films[J],SCIENTIFIC REPORTS,2017,7(1):13747
[8]Li, Ting,Tang, Zhenan,Huang, Zhengxing,Yu, Jun.Thermal boundary resistance between the polycrystalline graphene and the amorphous SiO2 substrate[J],CHEMICAL PHYSICS LETTERS,2017,685:349-353
[9]Huang, Zhengxing,Wang, Jiaqi,Bai, Suyuan,Guan, Jingwei,Zhang, Fengtian,Tang, Zhenan.Size Effect of Heat Transport in Microscale Gas Gap[J],IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,2017,64(9):7387-7391
[10]Hao, Menglong,Huang, Zhengxing,Saviers, Kimberly R.,Xiong, Guoping,Hodson, Stephen L.,Fisher, Timothy S..Characterization of vertically oriented carbon nanotube arrays as high-temperature thermal interface materials[J],INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER,2017,106:1287-1293
[11]Qu, Shilian,Tang, Zhenan,Liu, Wei,Li, Yuanfei,Wang, Zhigang,Jia, Yuzhen,Li, Chun,Xu, Ben,Chen, Wanqi,Bai, Suyuan,Huang, Zhengxing.Thermal conductivity measurement of the He-ion implanted layer of W using transient thermoreflectance technique[J],JOURNAL OF NUCLEAR MATERIALS,2017,484:382-385
[12]Li, Ting,Tang, Zhenan,Huang, Zhengxing,Yu, Jun.A comparison between the mechanical and thermal properties of single-walled carbon nanotubes and boron nitride nanotubes[J],PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES,2017,85:137-142
[13]黄正兴,王志刚,张鑫.高压下碳纳米管阵列与金属接触热阻研究[J],大连理工大学学报,2017,57(6):638-643
[14]黄正兴,关经纬,吴昊,余隽,唐祯安.比较法研究微细尺度氮化硅表面自然对流换热[J],电子器件,2016,39(6):1287-1291
[15]Li, Ting,Tang, Zhenan,Huang, Zhengxing,Yu, Jun.Interfacial thermal resistance of 2D and 1D carbon/hexagonal boron nitride van der Waals heterostructures[J],CARBON,2016,105:566-571
[16]黄正兴,孙童童,李倩倩.纳米尺度水薄膜液-气相变分子动力学模拟[J],大连理工大学学报,2016,56(3):230-235
[17]关经纬,黄正兴,唐祯安.微热板中微纳空气间隙传热特性研究[J],传感器与微系统,2016,35(5):9-12,15
[18]王立莹,黄正兴,唐祯安.铜/石墨烯柱结构热导的分子动力学研究[J],电子器件,2016,39(1):1-5
[19]唐祯安,余隽,黄正兴.A molecular dynamics simulation of the adsorption properties of H2, O2 and H2O on ZnO (100) by using a reactive force field[A],2016
[20]黄正兴,唐祯安.Thermal Conductance of Cu and Carbon Nanotube Interface Enhanced by a[J],Chinese Physics Letter,2015,32(8)
[21]Shen, Ning,Huang, Zhengxing,Tang, ZhenAn.A Low-Cost Uncooled Infrared Microbolometer by CMOS Process[J],ECS SOLID STATE LETTERS,2015,4(7):Q29-Q31
[22]Zheng, Kai,Wang, Liying,Bai, Suyuan,Yu, Jun,Tang, Zhenan,Huang, Zhengxing.An anomalous wave-like kinetic energy transport in graphene nanoribbons at high heat flux[J],PHYSICA B-CONDENSED MATTER,2014,434(1):64-68
[23]唐祯安,余隽,黄正兴.A low-cost infrared absorbing structure for an uncooled infrared detector[J],Journal of Semiconductors,2014,35(3):340141-340145
[24]唐祯安,余隽,黄正兴.A DFT Study of ZnO Nanostructures for Gas Sensing[A],2014
[25]申宁,余隽,黄正兴,唐祯安.基于CMOS工艺的双层非制冷热敏电阻型红外探测器[J],光电子·激光,2014,25(5):845-850
[26]Yu, Jun,Sun, Changyu,Huang, Zhengxing,Wu, Hao,Tang, Zhenan.A Double Layer Micro-bridge Calorimeter[A],10th IEEE Conference on Sensors,2011,870-873
[27]Huang, Zhengxing,Tang, Zhen'an,Yu, Jun,Bai, Suyuan.Temperature-dependent thermal conductivity of bent carbon nanotubes by molecular dynamics simulation[J],JOURNAL OF APPLIED PHYSICS,2011,109(10)
[28]Huang, Zheng Xing,Tang, Zhen An,Yu, Jun,Bai, Suyuan.Thermal conductivity of nanoscale polycrystalline ZnO thin films[J],PHYSICA B-CONDENSED MATTER,2011,406(4):818-823
[29]Yu, Jun,Tang, Zhen'an,Zhang, Fengtian,Ding, Haitao,Huang, Zhengxing.Measurement of the Heat Capacity of Copper Thin Films Using a Micropulse Calorimeter[J],JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME,2010,132(1):1-6
[30]Bai, Suyuan,Tang, Zhenan,Huang, Zhengxing,Yu, Jun.Thermal Characterization of Si3N4 Thin Films Using Transient Thermoreflectance Technique[J],IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,2009,56(8):3238-3243
[31]Bai Su-Yuan,Tang Zhen-An,Huang Zheng-Xing,Yu Jun,Wang Jing,Liu Gui-Chang.Preparation and Thermal Characterization of Diamond-Like Carbon Films[J],CHINESE PHYSICS LETTERS,2009,26(7)
[32]Yu, Jun,Tang, Zhen'an,Huang, Zhengxing,Feng, Chong.SIMULATION OF HEAT TRANSFER IN BRIDGE-BASED MICRO CALORIMETERS[A],7th International Conference on Nanochannels, Microchannels andMinichannels,2009,PART B:1179-1183
[33]Yu, J.,Tang, Z. A.,Yan, G. Z.,Chan, P. C. H.,Huang, Z. X..An experimental study on micro-gas sensors with strip shape tin oxide thin films[J],12th International Meeting on Chemical Sensors,2009,139(2):346-352
[34]Huang, Zhengxing,Tang, Zhenan,Yu, Jun,Bai, Suyuan.Thermal conductivity of amorphous and crystalline thin films by molecular dynamics simulation[J],PHYSICA B-CONDENSED MATTER,2009,404(12-13):1790-1793
[35]余隽,唐祯安,黄正兴,陈正豪.微热板阵列的热干扰[J],半导体学报,2008,29(8):1581-1584
[36]Yu, Jun,Tang, Zhen'an,Zhang, Fengtian,Ding, Haitao,Huang, Zhengxing.HEAT CAPACITY OF COPPER THIN FILMS MEASURED BY MICRO PULSE CALORIMETER[A],6th International Conference on Nanochannels, Microchannels andMinichannels,2008,PART A:513-517
[37]Bai Su-Yuan,Tang Zhen-An,Huang Zheng-Xing,Yu Jun,Wang Jia-Qi.Thermal conductivity measurement of submicron-thick aluminium oxide thin films by a transient thermo-reflectance technique[J],CHINESE PHYSICS LETTERS,2008,25(2):593-596
[38]唐祯安,余隽,黄正兴.Heterogeneous sensor state recognition based on data fusion for transporting hazardous chemicals[A],2008,1(1):81-81
[39]余隽,唐祯安,黄正兴.An experimental study on micro gas sensors with strip shape tin oxide thin films[A],12th International Meeting on Chemical Sensors,2008,1(1):49-49
[40]许自强,唐祯安,黄正兴,丁海涛.基于交流量热法的薄膜热扩散率自动测试系统的研究[J],仪器仪表学报,2005,26(8):797-800,821
[41]唐祯安,丁海涛,黄正兴,许自强,李新.二氧化硅薄膜比热容分子动力学模拟[J],大连理工大学学报,2005,45(3):313-315
[42]唐祯安,黄正兴,丁海涛,张虹霞.MEMS中薄膜热物性的分子动力学模拟[A],TFC’03全国薄膜技术学术研讨会,2003,2
[43]黄正兴,唐祯安,张红霞,沈玉秀,王庭峰.微尺度热传导现象及其研究状况[A],第二届全国传递过程学术研讨会,2003,Vol.22:80-85
[44]张虹霞,唐祯安,黄正兴,申爽.从头算方法研究SnO_2薄膜的能带和电子结构[A],TFC’03全国薄膜技术学术研讨会,2003,1
[45]唐祯安,黄正兴,顾毓沁,朱德忠.MEMS中薄膜热物性测试方法研究[J],仪表技术与传感器,2003,0(2):6-11,14
[46]黄正兴,唐祯安,张红霞,沈玉秀,王庭峰.微尺度热传导现象及其研究状况[J],化工进展,2003,22(z1):80-85

相关热点

扫码添加好友